Produktdetails

Rating Space Integrated isolated power No Isolation rating Basic Number of channels 4 Forward/reverse channels 3 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 5200 Transient isolation voltage (VIOTM) (VPK) 4242 Withstand isolation voltage (VISO) (Vrms) 3000 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 0.88 Current consumption per channel (1 Mbps) (typ) (mA) 1.48 Creepage (min) (mm) 3.7 Clearance (min) (mm) 3.7
Rating Space Integrated isolated power No Isolation rating Basic Number of channels 4 Forward/reverse channels 3 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 5200 Transient isolation voltage (VIOTM) (VPK) 4242 Withstand isolation voltage (VISO) (Vrms) 3000 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 0.88 Current consumption per channel (1 Mbps) (typ) (mA) 1.48 Creepage (min) (mm) 3.7 Clearance (min) (mm) 3.7
SSOP (DBQ) 16 29.4 mm² 4.9 x 6
  • Radiation Tolerant
    • Total Ionizing Dose (TID) Characterized (ELDRS-Free) = 30 krad(Si)
    • TID RLAT/RHA = 30 krad(Si)
    • Single-Event Latch-up (SEL) Immune to LET = 43 MeV⋅cm2/mg at 125°C
    • Single-Event Dielectric Rupture (SEDR) Immune (43 MeV⋅cm2/mg) at 500 VDC
  • Space Enhanced Plastic (Space EP)
    • Meets NASA’s ASTM E595 Outgassing Spec
    • Vendor Item Drawing (VID) V62/21610
    • Military Temp Range (-55°C to 125°C)
    • One Wafer Fabrication Site
    • One Assembly and Test Site
    • Gold Bond Wire, NiPdAu Lead Finish
    • Wafer Lot Traceability
    • Extended Product Life Cycle
    • Extended Product Change Notification
  • 600 VRMS continous working voltage
  • Section 6.7:
    • DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
  • 100 Mbps data rate
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output low
  • Low power consumption, 1.5 mA per channel typical at 1 Mbps
  • Low propagation delay: 10.7 ns typical (5-V Supplies)
  • Low channel-to-channel skew: 4 ns max (5-V Supplies)
  • ±100 kV/µs typical CMTI
  • System-level ESD, EFT, Surge, and Magnetic Immunity
  • Small QSOP (DBQ-16) package

  • Radiation Tolerant
    • Total Ionizing Dose (TID) Characterized (ELDRS-Free) = 30 krad(Si)
    • TID RLAT/RHA = 30 krad(Si)
    • Single-Event Latch-up (SEL) Immune to LET = 43 MeV⋅cm2/mg at 125°C
    • Single-Event Dielectric Rupture (SEDR) Immune (43 MeV⋅cm2/mg) at 500 VDC
  • Space Enhanced Plastic (Space EP)
    • Meets NASA’s ASTM E595 Outgassing Spec
    • Vendor Item Drawing (VID) V62/21610
    • Military Temp Range (-55°C to 125°C)
    • One Wafer Fabrication Site
    • One Assembly and Test Site
    • Gold Bond Wire, NiPdAu Lead Finish
    • Wafer Lot Traceability
    • Extended Product Life Cycle
    • Extended Product Change Notification
  • 600 VRMS continous working voltage
  • Section 6.7:
    • DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
  • 100 Mbps data rate
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output low
  • Low power consumption, 1.5 mA per channel typical at 1 Mbps
  • Low propagation delay: 10.7 ns typical (5-V Supplies)
  • Low channel-to-channel skew: 4 ns max (5-V Supplies)
  • ±100 kV/µs typical CMTI
  • System-level ESD, EFT, Surge, and Magnetic Immunity
  • Small QSOP (DBQ-16) package

The ISOS141-SEP radiation-tolerant device is a high-performance, quad-channel digital isolator in a small form factor 16-pin QSOP package. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. This device supports low Earth orbit (LEO) space applications with its high data rate of 100 Mbps, low propagation delay of 10.7 ns, and tight channel-to-channel skew of 4 ns. The ISOS141-SEP device has three forward and one reverse-direction channels and if the input power or signal is lost, the default output is low. The enable pins can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption.

The ISOS141-SEP provides high electromagnetic immunity and low emissions with low power consumption, while isolating CMOS or LVCMOS digital I/Os. The device has a high common-mode transient immunity of 100 kV/µs and can ease system-level ESD, EFT, surge, and simplify emissions compliance through its innovative chip design.

The ISOS141-SEP radiation-tolerant device is a high-performance, quad-channel digital isolator in a small form factor 16-pin QSOP package. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. This device supports low Earth orbit (LEO) space applications with its high data rate of 100 Mbps, low propagation delay of 10.7 ns, and tight channel-to-channel skew of 4 ns. The ISOS141-SEP device has three forward and one reverse-direction channels and if the input power or signal is lost, the default output is low. The enable pins can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption.

The ISOS141-SEP provides high electromagnetic immunity and low emissions with low power consumption, while isolating CMOS or LVCMOS digital I/Os. The device has a high common-mode transient immunity of 100 kV/µs and can ease system-level ESD, EFT, surge, and simplify emissions compliance through its innovative chip design.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 16
Typ Titel Datum
* Data sheet ISOS141-SEP Radiation Tolerant High-Speed Quad-Channel Digital Isolator datasheet PDF | HTML 05 Mär 2021
* Radiation & reliability report ISOS141-SEP Neutron Displacement Damage Characterization 18 Mär 2021
* Radiation & reliability report ISOS141-SEP Production Flow and Reliability Report 18 Mär 2021
* Radiation & reliability report ISOS141-SEP Quad-Channel Digital Isolator TID Report 17 Mär 2021
* Radiation & reliability report ISOS141-SEP Single-Event Latch-Up (SEL) Radiation Report 17 Mär 2021
Certificate VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) 31 Jan 2024
Technical article How Space Enhanced Products Address Challenges in low Earth orbit Applications (Rev. A) PDF | HTML 18 Dez 2023
Certificate UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) 05 Aug 2022
Application brief How to Isolate Signals with Digital Isolators in Emerging LEO Satellite Apps (Rev. A) PDF | HTML 06 Jul 2022
Selection guide TI Space Products (Rev. I) 03 Mär 2022
Technical article How space-grade digital isolation meets high radiation and immunity requirements i PDF | HTML 14 Okt 2021
Application brief Space-Grade, 30 krad, Isolated I2C Circuit PDF | HTML 01 Jun 2021
Application brief Space-Grade, 30-krad, Isolated CAN Serial Transceiver Circuit PDF | HTML 01 Jun 2021
Application brief Space-Grade, 30-krad, Isolated RS-422 Serial Transceiver Circuit PDF | HTML 01 Jun 2021
Technical article How to select the right digital isolator for your design PDF | HTML 21 Okt 2020
Technical article Top 9 design questions about digital isolators PDF | HTML 04 Feb 2019

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

DIGI-ISO-EVM — Evaluierungsmodul für universellen digitalen Isolator

DIGI-ISO-EVM ist ein Evaluierungsmodul (EVM), mit dem Sie alle ein-, zwei-, drei-, vier- oder sechskanaligen digitalen Isolatoren von TI in fünf verschiedenen Gehäusen evaluieren können: 8-poliges SOIC mit schmalem Gehäuse (D), 8-poliges SOIC mit breitem Gehäuse (DWV), 16-poliges SOIC mit breitem (...)

Benutzerhandbuch: PDF | HTML
Simulationsmodell

ISOS141-SEP IBIS Model

SLLM498.ZIP (63 KB) - IBIS Model
Gehäuse Pins Herunterladen
SSOP (DBQ) 16 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos