Produktdetails

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² (3 mm × 4.9 mm) SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm)
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) 24.06.2004
Anwendungshinweis PowerPAD™ Thermally Enhanced Package (Rev. H) 06.07.2018
Benutzerhandbuch TPA301EVM - User Guide (Rev. A) 17.04.2001

Design und Entwicklung

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Evaluierungsplatine

TPA301EVM — TPA301 – Evaluierungsmodul (EVM)

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

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Simulationsmodell

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