Produktdetails

Output power (W) 0.08 Analog supply (min) (V) 1.8 Analog supply voltage (max) (V) 4.5 Load (min) (Ω) 16 PSRR (dB) 80 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (µA) 1 Architecture Class-AB Iq per channel (typ) (mA) 3.7
Output power (W) 0.08 Analog supply (min) (V) 1.8 Analog supply voltage (max) (V) 4.5 Load (min) (Ω) 16 PSRR (dB) 80 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (µA) 1 Architecture Class-AB Iq per channel (typ) (mA) 3.7
DSBGA (YZH) 16 5.0625 mm² 2.25 x 2.25 WQFN (RTJ) 20 16 mm² 4 x 4
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet 80-mW DirectPath(TM) Stereo Headphone Driver datasheet (Rev. E) 04 Mär 2008
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 26 Aug 2019
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 27 Jun 2019
Analog Design Journal 2Q 2010 Issue Analog Applications Journal 06 Mai 2010
Analog Design Journal Precautions for connecting APA outputs to other devices 06 Mai 2010
EVM User's guide TPA4411EVM - User Guide (Rev. A) 09 Jan 2008
More literature TPA4411_NanoEVM_ Schematic 13 Feb 2007
More literature TPA4411_NanoEVM_OV 29 Jan 2007

Design und Entwicklung

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Evaluierungsplatine

TPA4411EVM — TPA4411 – Evaluierungsmodul (EVM)

The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)

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Gerberdatei

TPA4411 Gerber Files

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Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
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DSBGA (YZH) 16 Optionen anzeigen
WQFN (RTJ) 20 Optionen anzeigen

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