Home Datenwandler Integrierte & Spezialfunktions-Datenwandler Medizinische AFEs Ultraschall-AFEs
Home
Datenwandler
Integrierte & Spezialfunktions-Datenwandler
Medizinische AFEs
Ultraschall-AFEs
NEU

TX7164

AKTIV
Jetzt bestellen
Datenblatt

TX7164

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Device type Transmitter Number of input channels 64 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
Device type Transmitter Number of input channels 64 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
— (—) — See data sheet
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 0.5A
    • Maximum clamp current: 0.75A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 2.5MHz
    • –3dB Bandwidth with 400Ω || 125pF load
      • 11MHz for a ±100V supply
    • Very low receive power: 0.1 mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 21Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 10mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1 us for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 0.5A
    • Maximum clamp current: 0.75A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 2.5MHz
    • –3dB Bandwidth with 400Ω || 125pF load
      • 11MHz for a ±100V supply
    • Very low receive power: 0.1 mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 21Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 10mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1 us for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

TX7164 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX7164 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 0.5A.

Device can be used as a transmitter design resource for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX7164 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX7164 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 0.5A.

Device can be used as a transmitter design resource for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.
filter Andere Ultraschall-AFEs suchen
Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt TX7164 3-Level, 64-Channel Transmitter with On-Chip Beamformer, T/R Switch datasheet PDF | HTML 07.10.2026

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Treiber oder Bibliothek

TX7164-DESIGN — TX7164 design resources

The full data sheet and other design resources for this device are available here
Unterstützte Produkte und Hardware
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
— (—) —
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos