CC2652PSIP

ACTIVO

Módulo de sistema en encapsulado inalámbrico SimpleLink™ multiprotocolo de 2.4 GHz con amplificador

Detalles del producto

CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Proprietary 15.4, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS Type Wireless module Sensitivity (best) (dBm) -103 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG, TRNG Edge AI enabled No
CPU core Arm® Cortex®-M4F Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Proprietary 15.4, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS Type Wireless module Sensitivity (best) (dBm) -103 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG, TRNG Edge AI enabled No
QFM (MOT) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.5 mA active mode, CoreMark
    • 74 µA/MHz running CoreMark
    • 1 µA standby mode, RTC, 80KB RAM
    • 160 nA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30.1 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 7.3 mA RX at 2.4 GHz
    • 7.9 mA TX at 0 dBm
    • 10.9 mA TX at +5 dBm
    • 33 mA TX at +10 dBm

Wireless protocol support

High performance radio

  • -103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY

  • Output power up to +10 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any of 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOT ( 30 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.5 mA active mode, CoreMark
    • 74 µA/MHz running CoreMark
    • 1 µA standby mode, RTC, 80KB RAM
    • 160 nA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30.1 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 7.3 mA RX at 2.4 GHz
    • 7.9 mA TX at 0 dBm
    • 10.9 mA TX at +5 dBm
    • 33 mA TX at +10 dBm

Wireless protocol support

High performance radio

  • -103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY

  • Output power up to +10 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any of 30 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOT ( 30 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2652PSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Small 7-mm x 7-mm certified system-in-package module 2.4GHz with integrated DCDC components, balun, and crystal oscillators
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK).
  • Coin-cell operation at +10 dBm with transmit current consumption of 33 mA.
  • Longer battery life wireless applications with low standby current of 1 µA with full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-103 dBm for 125-kbps LE Coded PHY).

The CC2652PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2652PSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Small 7-mm x 7-mm certified system-in-package module 2.4GHz with integrated DCDC components, balun, and crystal oscillators
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK).
  • Coin-cell operation at +10 dBm with transmit current consumption of 33 mA.
  • Longer battery life wireless applications with low standby current of 1 µA with full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-103 dBm for 125-kbps LE Coded PHY).

The CC2652PSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC2652PSIP SimpleLink™ Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier datasheet (Rev. B) PDF | HTML 16 sep 2022
* Errata CC2652PSIP SimpleLink™ Wireless MCU Module Silicon Errata PDF | HTML 07 jun 2022
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 27 jun 2024
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
Application note CC2652PSIP OEM Integrators Guide PDF | HTML 19 ago 2022
Certificate CC2652PSIP UK DoC (Certification) 24 jun 2022
Certificate CC2652PSIP CE DoC (Certification) 25 feb 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 feb 2022
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 abr 2021
Application note RF PCB Simulation Cookbook 09 ene 2019
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Kit de desarrollo de software (SDK)

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Archivo Gerber

CC2652XSIP_EM Design Files

SWRC388.ZIP (1191 KB)
Esquema

LP-CC2652PSIP Design Files

SWRR172.ZIP (7286 KB)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
QFM (MOT) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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