MSP430FR6888

ACTIVO

MCU de detección rotativa con interfaz de escaneo ampliada, 96 KB FRAM, LCD para caudalímetros

Detalles del producto

CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 96 RAM (kByte) 2 ADC type 12-bit SAR Features Advanced sensing, DMA, LCD, Real-time clock, Scan interface UART 2 Number of ADC channels 16 SPI 4 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 96 Number of GPIOs 83 Number of I2Cs 2 Security Secure debug, Software IP protection
CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 96 RAM (kByte) 2 ADC type 12-bit SAR Features Advanced sensing, DMA, LCD, Real-time clock, Scan interface UART 2 Number of ADC channels 16 SPI 4 USB No Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Hardware accelerators 0 Nonvolatile memory (kByte) 96 Number of GPIOs 83 Number of I2Cs 2 Security Secure debug, Software IP protection
LQFP (PN) 80 196 mm² 14 x 14 LQFP (PZ) 100 256 mm² 16 x 16
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.02 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 128KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program + Data + Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to 7 Capture/Compare Registers Each
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Extended Scan Interface (ESI) for Background Water, Heat, and Gas Volume Measurement
    • 16-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 16 External Input Channels
    • Integrated LCD Driver With Contrast Control for up to 320 Segments
  • Multifunction Input/Output Ports
    • All P1 to P10 and PJ Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1, P2, P3, and P4
    • Programmable Pullup and Pulldown on All Ports
  • Code Security
    • True Random Number Seed for Random Number Generation Algorithm
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART and I2C Bootloader (BSL)
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology
    • Experimenter and Development Kits
  • Family Members
    • Device Comparison Summarizes the Device Variants and Available Packages Types
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)RTC is clocked by a 3.7-pF crystal.

  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.02 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 128KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program + Data + Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to 7 Capture/Compare Registers Each
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Extended Scan Interface (ESI) for Background Water, Heat, and Gas Volume Measurement
    • 16-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 16 External Input Channels
    • Integrated LCD Driver With Contrast Control for up to 320 Segments
  • Multifunction Input/Output Ports
    • All P1 to P10 and PJ Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1, P2, P3, and P4
    • Programmable Pullup and Pulldown on All Ports
  • Code Security
    • True Random Number Seed for Random Number Generation Algorithm
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART and I2C Bootloader (BSL)
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology
    • Experimenter and Development Kits
  • Family Members
    • Device Comparison Summarizes the Device Variants and Available Packages Types
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)RTC is clocked by a 3.7-pF crystal.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet MSP430FR688x(1), MSP430FR588x(1) Mixed-Signal Microcontrollers datasheet (Rev. C) PDF | HTML 29 ago 2018
* Errata MSP430FR6888 Microcontroller Errata (Rev. AA) PDF | HTML 21 oct 2021
* User guide MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P) PDF | HTML 21 abr 2020
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. B) PDF | HTML 02 jun 2025
User guide MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB) PDF | HTML 22 sep 2022
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 ago 2021
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 ago 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 may 2021
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 dic 2019
White paper Capacitive Touch and MSP Microcontrollers (Rev. A) 27 abr 2017
Application note Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B) 03 nov 2016
Application note Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E) PDF | HTML 03 nov 2016
Application note Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D) 03 nov 2016
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 abr 2016
Application note Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A) 30 mar 2016
Application note MSP Code Protection Features PDF | HTML 07 dic 2015
Application note Designing With MSP430™ MCUs and Segment LCDs (Rev. A) PDF | HTML 20 jul 2015
Application note Migrating From MSP430FW42x Scan Interface to MSP430FR6x8x/FR5x8x ESI (Rev. A) 06 feb 2015
Application note Adjustment of ESIOSC Oscillator Frequency (Rev. A) 30 ene 2015
Application note Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A) 29 ene 2015
White paper Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers 15 sep 2014
Application note LC Sensor Rotation Detection With MSP430 Extended Scan Interface (ESI) 28 ago 2014
Application note Method to Select the Value of LC Sensor for MSP430 Extended Scan Interface (ESI) 28 ago 2014
Application note MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology 09 jun 2014
Application note MSP430 FRAM Quality and Reliability (Rev. A) 01 may 2014
White paper FRAM FAQs 23 abr 2014
White paper Enabling secure portable medical devices with TI’s MSP430™ MCU 04 jun 2013
White paper Benchmarking MCU power consumption for ultra-low-power applications 26 oct 2012

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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This collection of (...)

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SLAC668 MSP430FR5x8x, MSP430FR692x, MSP430FR6x7x, MSP430FR6x8x Code Examples

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MSP-DSPLIB Digital Signal Processing (DSP) Library for MSP Microcontrollers

The TI MSP430™ Digital Signal Processing library is a set of optimized functions to perform common signal processing operations for MSP430 microcontrollers. These functions are used in applications where processing-intensive transforms are done in real-time for minimal energy and with very (...)

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MSP-FRAM-UTILITIES FRAM embedded software utilities for MSP ultra-low-power microcontrollers

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MSP-GRLIB MSP Graphics Library

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MSPMATHLIB — Biblioteca matemática de punto flotante para MSP430

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Guía del usuario: PDF
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MSPFRBOOT MSPFRBOOT

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Primeros pasos

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CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

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ENERGYTRACE — Tecnología EnergyTrace

EnergyTrace™ software for MSP430™ MCUs, MSP432™ MCUs, CC13xx wireless MCUs and CC26xx wireless MCUs is an energy-based code analysis tool that measures and displays the energy profile of an application and helps optimize it for ultra-low-power consumption.

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Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
LQFP (PN) 80 Ultra Librarian
LQFP (PZ) 100 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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