SN74GTLP817

ACTIVO

Controlador de salida del ventilador GTLP a LVTTL de 1 a 6

Detalles del producto

Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • GTLP-to-LVTTL 1-to-6 Fanout Driver
  • LVTTL-to-GTLP 1-to-2 Fanout Driver
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • Reduced-Drive LVTTL Outputs (\x9612 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI are trademarks of Texas Instruments.

  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • GTLP-to-LVTTL 1-to-6 Fanout Driver
  • LVTTL-to-GTLP 1-to-2 Fanout Driver
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • Reduced-Drive LVTTL Outputs (\x9612 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI are trademarks of Texas Instruments.

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC .

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Documentación técnica

star =Principal documentación para este producto seleccionada por TI
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Tipo Título Fecha
* Data sheet GTLP-to-LVTTL 1-to-6 Fanout Driver datasheet (Rev. E) 14 ago 2001
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Application note Logic in Live-Insertion Applications With a Focus on GTLP 14 ene 2002
User guide GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 15 sep 2001
Application note Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP) 05 abr 2001
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application brief Texas Instruments GTLP Frequently Asked Questions 01 ene 2001
Application note Fast GTLP Backplanes With the GTLPH1655 (Rev. A) 19 sep 2000
More literature High Level Brochure of Gunning Transceiver Logic Plus 14 ene 2000

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Modelo de simulación

HSPICE Model of SN74GTLP817

SCEJ119.ZIP (37 KB) - HSpice Model
Modelo de simulación

SN74GTLP817 IBIS Model

SCEM187.ZIP (25 KB) - IBIS Model
Paquete Pasadores Descargar
TSSOP (PW) 24 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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