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AFE de ultrasonido

TX73H32

ACTIVO

Transmisor de 32 canales y 3 niveles con pulsador de 2 A y formador de haces de transmisión integrad

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TX73H32

ACTIVO
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Detalles del producto

Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
FCCSP (ACP) 196 144 mm² (12 mm × 12 mm)
  • Transmitter supports:
    • 32-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±2V
    • Maximum output current: 2A
    • True return to zero to discharge output to ground
    • Second harmonic of –43dBc at 5MHz
    • –3-dB Bandwidth with 220Ω || 220pF load
      • 19MHz for a ±100V supply
    • Very low receive power: 0.4mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 13Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 20mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
    • Global repeat feature present, enabling long-duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High-reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 32-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±2V
    • Maximum output current: 2A
    • True return to zero to discharge output to ground
    • Second harmonic of –43dBc at 5MHz
    • –3-dB Bandwidth with 220Ω || 220pF load
      • 19MHz for a ±100V supply
    • Very low receive power: 0.4mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 13Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 20mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
    • Global repeat feature present, enabling long-duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High-reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies.

TX73H32 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A.

Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies.

TX73H32 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A.

Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos TX73H32 3-Level, 32-Channel Transmitter with On-Chip Beamformer, T/R Switch datasheet (Rev. A) PDF | HTML 25/11/2024
Nota sobre la aplicación An Overview of TI's Transmitter Products for Ultrasound Applications PDF | HTML 8/07/2025
Product overview Optimizing the Size of Handheld Ultrasound Front-End Circuit Designs PDF | HTML 15/12/2023
Application brief Building High-Performance NDT Systems with Ultrasound Transmitters and Receivers PDF | HTML 4/08/2023

Diseño y desarrollo

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Placa de evaluación

TX73H32EVM — Módulo de evaluación TX73H32

El módulo de evaluación (EVM) TX73H32 se usa para la evaluación del dispositivo TX73H32 bajo diversas fuerzas de accionamiento, distintos niveles de tensión y distintos modos del dispositivo. El EVM contiene todas las señales de control necesarias y la generación de alimentación integrada, lo que (...)

Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCCSP (ACP) 196 Ultra Librarian
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