CD4081B-MIL
- Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
- 100% tested for quiescent current at 20 V
- Maximum input current of 1 µA at 18 V over full package-temperature range: 100 nA at 18 V and 25°C
- Noise margin (full package-temperature range) =
- 1 V at VDD = 5 V
- 2 V at VDD = 10 V
- 2.5 V at VDD = 15 V
- Standardized, symmetrical output characteristics
- 5-V, 10-V, and 15-V parametric ratings
- Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
CD4073B Triple 3-Input AND Gate
CD4081B Quad 2-Input AND Gate
CD4082B Dual 4-Input AND Gate
Data sheet acquired from Harris Semiconductor
CD4073B, CD4081B and CD4082B AND gates, provide the system designer with direct implementation of the AND function and supplement the existing family of CMOS gates.
The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
기술 자료
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8개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CD4073B, CD4081B, CD4082B TYPES datasheet (Rev. C) | 2003/08/21 | |
* | SMD | CD4081B-MIL SMD 7702402CA | 2016/06/21 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 2001/12/03 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 14 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치