데이터시트
CSD95472Q5MC
- 60-A Continuous Operating Current Capability
- 94.4% System Efficiency at 1.2 V / 30 A
- Low Power Loss of 2.3 W at 30 A
- High-Frequency Operation (up to 1.25 MHz)
- Diode Emulation Mode With FCCM
- Temperature-Compensated Bidirectional Current
Sense - Analog Temperature Output (600 mV at 0°C)
- Fault Monitoring
- High-Side Short, Overcurrent, and
Overtemperature Protection
- High-Side Short, Overcurrent, and
- 3.3-V and 5-V PWM Signal Compatible
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Optimized Deadtime for Shoot-Through Protection
- High-Density SON 5 × 6 mm Footprint
- Ultralow Inductance Package
- System-Optimized PCB Footprint
- DualCool™ Packaging
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 문서
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모두 보기1 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | CSD95472Q5MC Synchronous Buck NexFET Smart Power Stage datasheet | PDF | HTML | 2016/02/12 |
설계 및 개발
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레퍼런스 디자인
PMP20176 — 인텔 Stratix 10 GX FPGA용 4상, 140A 레퍼런스 디자인
This reference design focuses on providing a compact, high-performance, multiphase solution suitable for powering Intel® Stratix® 10 GX field-programmable gate arrays (FPGAs) with a specific focus on the SG2800-I1V variant. Integrated PMBus™ allows for easy output voltage setting and (...)
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| VSON-CLIP (DMC) | 12 | 옵션 보기 |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치