CY74FCT2373T
- Function and Pinout Compatible With the Fastest Bipolar Logic
- 25-
Output Series Resistors Reduce Transmission-Line Reflection Noise - Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- 3-State Outputs
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Fully Compatible With TTL Input and Output Logic Levels
- 12-mA Output Sink Current
15-mA Output Source Current
The CY74FCT2373T is an 8-bit, high-speed CMOS, TTL-compatible buffered latch with 3-state outputs that is
ideal for driving high-capacitance loads, such as memory and address buffers. On-chip 25-
termination
resistors at the outputs reduce system noise caused by reflections. The CY74FCT2373T can replace the
CY74FCT373T to reduce noise in an existing design.
When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE\) input is low. When OE\ is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Latch With 3-State Outputs datasheet (Rev. B) | 2001/10/01 | |
| Selection guide | Logic Guide (Rev. AC) | PDF | HTML | 2025/11/13 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치