MSPM0-SDK — MSPM0 Software Development Kit (SDK)
The MSPM0 SDK provides the ultimate collection of software, tools and documentation to accelerate the development of applications for the MSPM0 MCU platform under a single software package.
(1)MSPM0L134x only
MSPM0L134x and MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.
The MSPM0L134x and MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.
The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their projects needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.
MSPM0L134x and MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.
For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LP-MSPM0L1306 LaunchPad™ 개발 키트는 MSPM0L1306에 기반을 둔 사용이 쉬운 EVM(평가 모듈)입니다. 프로그래밍, 디버깅 및 에너지 측정을 위한 온보드 디버그 프로브를 포함하여 MSPM0L1306 M0+ MCU 플랫폼에서 개발을 시작하는 데 필요한 모든 것이 포함되어 있습니다. 보드에는 3개의 버튼, 2개의 LED(하나는 RGB LED), 아날로그 온도 센서 및 조명 센서가 포함되어 있습니다.
텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.
텍사스 인스트루먼트 XDS110은 TI (...)
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