SN54AS825A
- Functionally Equivalent to AMD's AM29825
- Improved IOH Specifications
- Multiple Output Enables Allow Multiuser Control of the Interface
- Outputs Have Undershoot-Protection Circuitry
- Power-Up High-Impedance State
- Buffered Control Inputs Reduce dcLoading Effects
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing multiuser registers, I/O ports, bidirectional bus drivers, and working registers.
With the clock-enable (
)
input low, the eight D-type edge-triggered flip-flops enter data on
the low-to-high transitions of the clock (CLK) input. Taking
high disables the clock buffer,
latching the outputs. These devices have noninverting data (D)
inputs. Taking the clear (
)
input low causes the eight Q outputs to go low independently of the
clock.
Multiuser buffered output-enable (
,
, and
) inputs can be used to place the
eight outputs in either a normal logic state (high or low logic
level) or a high-impedance state. In the high-impedance state, the
outputs neither load nor drive the bus lines significantly. The
high-impedance state and increased drive provide the capability to
drive bus lines without interface or pullup components.
The output enables do not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN54AS825A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AS825A is characterized for operation from 0°C to 70°C.
= H if any of
OE1\, OE2\, or OE3\ are high.
= L if all of
OE1\, OE2\, or OE3\ are low.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Bus-Interface Flip-Flops With 3-State Outputs datasheet (Rev. B) | 1995/08/01 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치