제품 상세 정보

Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Configuration 1:1 SPST Number of channels 4 Bandwidth (MHz) 200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 7 CON (typ) (pF) 2.5 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 2 VIL (max) (V) 0.8 Rating Automotive
Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Configuration 1:1 SPST Number of channels 4 Bandwidth (MHz) 200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 7 CON (typ) (pF) 2.5 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 2 VIL (max) (V) 0.8 Rating Automotive
TSSOP (PW) 14 32 mm² 5 x 6.4
  • Standard 126-type pinout
  • 5-Ω switch connection between two ports
  • Rail-to-rail switching on data I/O ports
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • Standard 126-type pinout
  • 5-Ω switch connection between two ports
  • Rail-to-rail switching on data I/O ports
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II

The SN74CBTLV3126-Q1 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The SN74CBTLV3126-Q1 device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull down resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBTLV3126-Q1 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The SN74CBTLV3126-Q1 device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull down resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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* Data sheet SN74CBTLV3126-Q1 Low-Voltage Quadruple FET Bus Switch datasheet PDF | HTML 2025/12/11
Selection guide Logic Guide (Rev. AC) PDF | HTML 2025/11/13
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
More literature Digital Bus Switch Selection Guide (Rev. A) 2004/11/10
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Bus FET Switch Solutions for Live Insertion Applications 2003/02/07
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
User guide CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) 1998/12/01

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TSSOP (PW) 14 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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