SN74F283
- Full-Carry Look-Ahead Across the Four Bits
- Systems Achieve Partial Look-Ahead Performance With the Economy of Ripple Carry
- Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs
The ´F283 is a full adder that performs the addition of two 4-bit binary words. The sum ( ) outputs are provided for each bit and the resultant carry (C4) output is obtained from the fourth bit.
The device features full internal look-ahead across all four bits generating the carry term C4 in typically 5.7 ns. This capability provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation.
The adder logic, including the carry, is implemented in its true form. End-around carry can be accomplished without the need for logic or level inversion.
The ´F283 can be used with either all-active-high (positive logic) or all-active-low (negative logic) operands.
The SN54F283 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F283 is characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 4-Bit Binary Full Adders With Fast Carry datasheet (Rev. A) | 1993/10/01 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| PDIP (N) | 16 | 옵션 보기 |
| SOIC (D) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치