TPS63820
- Input voltage range: 1.8V to 5.5V
- 2.0V minimum input voltage for start-up
- VOUT range: I2C-configurable 1.2V to 5.5V with 25mV step
- Output current
- Up to 3.5A for VIN ≥ 2.5V, VOUT = 3.3V
- Up to 4A for VIN ≥ 3V, VOUT = 3.3V
- High efficiency over the entire load range
- Low 2.3µA operating quiescent current
- Automatic power save mode, ultra-sonic mode, and forced PWM mode
- 91.94% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 100µA (in buck-boost mode)
- 95.33% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 2A (in buck-boost mode)
- Supports 1.2V logic I/O
- Three I2C target addresses available by ADDR pin connection
- Programmable soft start time, current limit, and buck-boost window
- Output discharge function
- Safety and robust protection features
- Overtemperature protection
- Input and output overvoltage protection
- True load disconnect during shutdown
- Forward and backward current limit
- Hiccup protection
- Two device options:
- TPS63820: Pre-programmed 3.3V VOUT
- TPS638201: Program VOUT prior to start-up
- 15-ball WCSP package (2.0mm × 1.2mm)
The TPS63820 and TPS638201 are low quiescent current, high output current buck-boost converters fully programmable through I2C. The 2.3µA quiescent current and four low Rdson MOSFETs enable high efficiency from a light to a heavy load range.
Depending on the input voltage, the devices automatically operate in boost, buck, or in buck-boost mode when the input voltage is approximately equal to the output voltage. The transitions between modes occur at defined thresholds and avoid unwanted toggling within the modes which reduces output voltage ripple.
The devices have a fast dynamic response, which enables the regulation of output voltage tightly, even in the event of heavy load transients.
The devices offer a small solution size in WCSP. The solution size is <20mm2 with only four external components.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 날짜 |
|---|---|---|---|---|
| * | Data sheet | TPS63820 – Low Quiescent Current, 4A Buck-Boost Converters with I2C Interface datasheet | PDF | HTML | 2026/03/09 |
| EVM User's guide | TPS63820 Evaluation Module | PDF | HTML | 2026/03/10 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPS63820EVM — TPS63820 evaluation module
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YBG) | 15 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.