TSU6111
- Dual SP2T
- USB & UART Path support USB 2.0 High Speed
- Smart Detection
- Plug-in/Un-plug Detection
- USB Charger Detection
- Impedance Detection
- Detection is Compatible to CEA-936A
(4-Wire Protocol, UART interface)
- Charger Detection
- USB BCDv1.1 Compliant
- VBUS Detection
- Data Contact Detection
- Primary and Secondary Detection
- Compatible Accessories
- USB Cable
- UART Cable
- USB Charger BCDv1.1
- Additional Features
- I2C Interface with Host Processor
- Support Control Signals Used In Manufacturing (JIG, BOOT)
- Interrupt for Attach and Detach Accessory
- Max Voltage
- 28v VBUS rating
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- ESD Performance DP/DM/ID/VBUS to GND
- ±8kV Contact Discharge (IEC 61000-4-2)
- Surge Protection on VBUS/DP/DM
- USB Connector Pins Without External Components
The TSU6111 is a differential high performance automated SP2T switch with impedance detection. The switch features impedance detection which supports the detection of various accessories that are attached through DP, DM and ID. The charger detection satisfies USB charger specification v1.1. VBUS_IN has 28V tolerance to avoid external protection.
Power for this device is supplied through VBAT of the system or through VBUS_IN when attached.
The switch is controlled by automatic detection logic or through I2C manually. JIG and BOOT pins are used when a USB, UART JIG cable is used to test in the development and manufacturing. TSU6111 has open-drain JIG output (active low).
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SP2T SWITCH WITH IMPEDANCE DETECTION MICRO-USB SWITCH TO SUPPORT USB, UART datasheet | 2011/09/06 | |
| Application note | High-Speed Interface Layout Guidelines (Rev. J) | PDF | HTML | 2023/02/24 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| UQFN (RSV) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.