產品詳細資料

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configurations Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configurations Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The SN54ACT16244 and 74ACT16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide true outputs and symmetrical (active-low) output-enable inputs.

The 74ACT16244 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN54ACT16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16244 is characterized for operation from -40°C to 85°C.

 

 

The SN54ACT16244 and 74ACT16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide true outputs and symmetrical (active-low) output-enable inputs.

The 74ACT16244 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN54ACT16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16244 is characterized for operation from -40°C to 85°C.

 

 

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SN74ACT244 現行 具有 TTL 相容 CMOS 輸入和三態輸出的八通道 4.5-V 至 5.5-V 緩衝器 Voltage range (4.5V to 5.5V), average drive strength (24mA), average propagation delay (8ns)

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類型 標題 日期
* Data sheet SN54ACT16244, 74ACT16244 datasheet (Rev. B) 1996年 4月 1日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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模擬型號

74ACT16244 Behavioral SPICE Model

SCAM080.ZIP (7 KB) - PSpice Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian

訂購與品質

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  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
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  • 組裝地點

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