AFE0256
- 256 Channels
- On-Chip, 14-Bit ADC
- High Performance:
- Noise: 758 electronRMS (eRMS) with
28-pF Sensor Capacitor in 1.2-pC Range - Integral Nonlinearity: ±1.25 LSB
with Internal 14-Bit ADC - Minimum Scan Time:
- Normal Mode:
37.9 µs, Internal ADC - 2x Binning Mode: 26 µs, Internal ADC
- Normal Mode:
- Noise: 758 electronRMS (eRMS) with
- Integration:
- Eight Selectable, Full-Scale Ranges:
- 0.15 pC (min) to 9.6 pC (max)
- Built-In Correlated Double Sampler
- 2x Binning for Faster Throughput:
- Averages
Charge of Two Adjacent Channels
- Averages
- Pipelined Integration and Read:
- Allows Data Read During Integration
- Eight Selectable, Full-Scale Ranges:
- Flexibility:
- Electron and Hole Integration
- Analog Output Provided for External
High-Resolution ADC
- Low Power:
- 2.9 mW per Channel with ADC
- 2.3 mW per Channel without ADC
- 0.1 mW per Channel in Nap Mode
- Total Power-Down Feature
- 22-mm × 5-mm Gold-Bump Die Suitable for
Tape Carrier Package (TCP) or Chip-on-Film (COF)
The AFE0256 is a 256-channel analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD)-based digital x-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale charge level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four differential output drivers.
The device also features four 14-bit successive-approximation register (SAR) analog-to-digital converters (ADCs) on board. Serial data from the ADCs are available in SPI format.
Hardware-selectable integration polarity allows positive or negative charge integration and provides more flexibility in system design. The Nap feature enables substantial power saving that is especially useful in battery-powered systems.
The AFE0256 is available as a 22-mm × 5-mm singulated format with known good gold-bump dies.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 256-Channel Analog Front-End for Flat-Panel Digital X-Ray Detector . datasheet (Rev. A) | 2013年 8月 23日 |
設計與開發
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點