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CC2651R3SIPA

現行

具有整合式天線的 SimpleLink™ 多協定 2.4-GHz 無線統級封裝模組

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CC2651R3SIPA

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm® Cortex®-M4 Protocols Bluetooth® Low Energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Flash memory (kByte) 352 RAM (kByte) 32 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Features OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS Type Wireless module Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Edge AI enabled No
CPU Arm® Cortex®-M4 Protocols Bluetooth® Low Energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Flash memory (kByte) 352 RAM (kByte) 32 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Features OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Cryptographic accelerators RNG Operating system FreeRTOS Type Wireless module Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105 Edge AI enabled No
QFM (MOU) 50 49 mm² (7 mm × 7 mm)

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • T j: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • T j: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.
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CC2652RSIP 現行 具有 352-KB 記憶體的 SimpleLink™ 多協定 2.4-GHz 無線統級封裝模組 Option with additional memory and external antenna

技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory datasheet (Rev. B) PDF | HTML 2023/8/17
* 使用指南 CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 2022/2/14
* 勘誤表 CC2651R3SIPA Errata (Rev. A) PDF | HTML 2022/6/29
網路安全諮詢 Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 2026/5/28
網路安全諮詢 Denial of Service during Bluetooth LE authentication and connection PDF | HTML 2026/5/28
應用說明 CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 2024/8/6
應用說明 CC2651R3SIPA OEM Integrators Guide PDF | HTML 2022/8/19
證書 CC2651R3SIPA UK Doc (Certification) 2022/6/24
應用說明 Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/2/25
證書 CC2651R3SIPA CE DoC (Certification) 2022/2/25
應用說明 RF PCB Simulation Cookbook 2019/1/9
應用說明 TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 2017/2/28

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-CC2651R3SIPA — 適用於 SimpleLink™ 多協定 2.4-GHz 無線 SIP 模組的 CC2651R3SIPA LaunchPad™ 開發套件

此 LaunchPad™ 開發套件具備整合式天線 MCU，可加快 SimpleLink™ 多標準 CC2651R3SIPA 無線 MCU 模組的開發速度，並可支援 Bluetooth® 5 低耗能 (LE) 和 IEEE 802.15.4 協定 (包括 ZigBee® 和 TL 15.4 應用)。CC13XX-CC26XX 軟體開發套件 (SDK) 提供軟體支援。

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ALGO-3P-UISP1-TI — 適用於德州儀器裝置的 Algocraft μISP1 編程器

μISP 可以連接到主機 PC (內建 RS-232、USB、LAN 連接) 或獨立模式工作。

在單機模式下，只要按下「開始」按鈕或透過一些 TTL 控制線，就可以執行編程週期。

其緊湊的尺寸和多功能性可輕鬆整合到生產環境、手動和自動化程序中。

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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

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偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器（模擬器）。對於大多數裝置，建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準（IEEE1149.1、IEEE1149.7、SWD）。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器（配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器）連接到目標電路板，並透過 USB2.0 高速 (...)

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硬體程式設計工具

ALGO-3P-WRITENOW — Algocraft WriteNow！程式設計工具

WriteNow! 系統內編程器系列是可編程產業的一大突破。此編程器支援多家製造商的眾多裝置 (例如微控制器、記憶體、CPLD 與其他可編程裝置)。其尺寸精巧，便於整合至 ATE 與固定裝置。編程器可單機運作，或透過內建的 RS-232、LAN 與 USB 連接埠與主機電腦連線，並隨附操作簡易的工具軟體。

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F2-SDK — SimpleLink™ Low Power F2 software development kit (SDK) for the CC13x1, CC13x2, CC13x4, CC26x1, CC26x2 and CC26x4 devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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軟體開發套件 (SDK)

TI-15-4-STACK-GATEWAY-LINUX-SDK — TI 15-4-Stack Gateway Linux Software Development Kit

The TI-15.4-Stack-Gateway-Linux Software Development Kit (SDK) provides a Linux software middleware for the TI 15.4-Stack companion solution. It includes a full Linux user-space software that runs on top of the TI Processor SDK for AM335x platform, which interfaces with the co-processor embedded (...)

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ARM-CGT — Arm® 程式碼產生工具 - 編譯器

The TI Arm® compiler tools are an essential component of the CCStudio™ development ecosystem, providing robust support for TI Arm-based platforms. They are engineered to maximize the potential of TI Arm Cortex®-M and Cortex-R series devices.

The current tools ARM-CGT-CLANG are derived from the (...)

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CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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SENSOR-CONTROLLER-STUDIO — Sensor Controller Studio

Sensor Controller Studio is used to write, test and debug code for the CC26xx/CC13xx Sensor Controller, enabling ultra-low power application design. The tool generates an interface driver consisting of C source files with the firmware image, associated definitions, and generic functions that allow (...)

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SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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軟體程式設計工具

FLASH-PROGRAMMER — SmartRF Flash Programmer

SmartRF Flash Programmer 2 可在德州儀器 ARM 架構低功耗 RF 無線 MCU 中，透過偵錯與序列介面進行快閃記憶體編程。查看支援產品相容性清單。Uniflash 也可用於編程任何 SimpleLink 產品。

SmartRF Flash Programmer 可在德州儀器 8051 型低功耗 RF 無線 MCU 中的進行快閃記憶體編程，並可在 SmartRF05 評估電路板、SmartRF 收發器評估電路板 (TrxEB) 和 CC 偵錯器上升級韌體和開機載入程式。

SmartRF Flash Programmer 和 SmartRF Flash (...)

lock = 需要匯出核准 (1 分鐘)
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軟體程式設計工具

UNIFLASH — UniFlash 快閃記憶體編程工具

UniFlash 是 TI 龐大 CCStudio™ 開發生態系統的一部分，是一款用於在 TI 微控制器與無線連線裝置上對晶片內快閃記憶體進行燒錄，以及在 TI 處理器上對板載快閃記憶體進行燒錄的軟體工具。UniFlash 提供圖形化介面與命令行介面，並可在桌面上或雲端中執行。

UniFlash 可從 CCStudio™ 開發人員區上的雲端執行，或在下載後於 Windows®、Linux® 和 macOS® 電腦中使用。

請注意，mmWave、AMx、K2G 和 J7 裝置不支援 macOS。AMx、K2G 和 J7 裝置僅於命令列上支援。

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支援軟體

RF-RANGE-ESTIMATOR — RF Range Estimator

This tool is used to calculate a range estimate for indoor and outdoor RF links using TI wireless devices. The outdoor calculation is based upon Line-of-Sight (LOS). For the indoor estimation, construction materials can be selected that are between the Tx and Rx unit. The greater the attenuation (...)
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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
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計算工具

Z-STACK-CALC — Z-Stack Power Calculator

此工具讓 SimpleLink™ Z-Stack™ 軟體使用者可在 Zigbee 應用中分析休眠終端裝置的系統電源設定檔。此計算機可讓使用者評估系統電池的潛在使用壽命，並透過配置系統設定、堆疊參數、有效載荷設定檔和使用參數來最佳化電池壽命，從而透過模擬系統設計選擇來實現預期的性能目標。
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認證

CC26XX-REPORTS — CC26xx Regulatory Certification Reports

您是否正在尋找 CC26xx 模組認證支援？CC26xx 認證可為您的產品成功認證提供相關資訊和支援。在此頁面中，您會找到我們模組及評估電路板的最新認證報告。
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設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

第三方無線模組搜尋工具協助開發人員識別符合其終端設備規格的產品，並採購可投入生產的無線模組。搜尋工具中包含的第三方模組供應商是獨立的第三方公司，擁有使用 TI 無線連接產品設計與製造無線模組的專業知識。

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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

SimpleLink 硬體設計審核流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。一個簡單的三步驟流程用於請求審查，以及相關技術文件和資源的連結，可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中，然後才能要求 2.4 GHz 硬體設計審查。

請確實備妥下列必要文件，隨硬體設計審查申請表一起傳送：

  • 確認產品頁上提供的所有硬體文件均已經過審查，例如產品規格表、設計指南、使用指南和其他硬體資源
  • 電路圖的可攜式文件格式 (PDF) 版本可供檢閱
  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
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