DRV3205-Q1
- AEC-Q100 Qualified for Automotive Applications:
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Three-Phase Bridge Driver for Motor Control
- Suitable for 12-V and 24-V Applications
- Three Integrated High-Accuracy Current Sense Amplifiers
- Integrated Boost Converter, Gate Drive to 4.75 V
- Drives 6 Separate N-Channel Power MOSFETs
- Strong 1-A Gate Drive for High-Current FETs
- Programmable Dead Time
- PWM Frequency up to 20 kHz
- Supports 100% Duty Cycle Operation
- Short-Circuit Protection
- VDS-Monitoring (Adjustable Detection Level)
- Shunt Current Limit (Adjustable Detection Level)
- Overvoltage and Undervoltage Protection
- Overtemperature Warning and Shut Down
- Sophisticated Failure Detection and Handling Through SPI
- System Supervision
- Q&A Watchdog
- I/O Supply Monitoring
- ADREF Monitoring
- Programmable Internal Fault Diagnostics
- Sleep Mode Function
- Thermally-Enhanced 48-Pin HTQFP PowerPAD™ IC Package (7-mm × 7-mm Body)
The DRV3205-Q1 bridge driver is dedicated to automotive three-phase brushless DC motor control applications. The device provides six dedicated drivers for standard-level N-channel MOSFET transistors. A boost converter with an integrated FET provides the overdrive voltage, allowing full control on the power stages even for low battery voltage down to 4.75 V. The strong driver strength is suitable for high-current applications and programmable to limit peak output current.
The device incorporates robust FET protection and system monitoring functions like a Q&A watchdog and voltage monitors for I/O supplies and ADC reference voltages. Integrated internal diagnostic functions can be accessed and programmed through an SPI interface.
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DRV3205EVM — DRV3205-Q1 三相車用閘極驅動器評估模組
The Texas Instruments DRV3205 evaluation module (DRV3205EVM) helps designers evaluate the operation and performance of the DRV3205-Q1 and DRV3220-Q1 bridge driver for motor driver applications. The DRV3205EVM can be designed with may TI MCU families with Micro-Control LaunchPads. The device (...)
| 封裝 | 引腳 | 下載 |
|---|---|---|
| HTQFP (PHP) | 48 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點