LPV7215
- (For V+ = 1.8 V, Typical Unless Otherwise Noted)
- Ultra-Low Power Consumption: 580 nA
- Wide Supply Voltage Range: 1.8 V to 5.5 V
- Propagation Delay: 4.5 µs
- Push-Pull Output Current Drive at 5 V 19 mA
- Temperature Range: −40°C to 125°C
- Rail-to-Rail Input
- Tiny 5-Pin SOT-23 and SC70 Packages
The LPV7215 device is an ultra-low-power comparator with a typical power supply current of 580 nA. It has the best-in-class power supply current versus propagation delay performance available among TIs low-power comparators. The propagation delay is as low as 4.5 µs with 100-mV overdrive at 1.8-V supply.
Designed to operate over a wide range of supply voltages, from 1.8 V to 5.5 V, with ensured operation at 1.8 V, 2.7 V, and 5 V, the LPV7215 is ideal for use in a variety of battery-powered applications. With rail-to-rail common-mode voltage range, the LPV7215 is well suited for single-supply operation.
Featuring a push-pull output stage, the LPV7215 allows for operation with absolute minimum power consumption when driving any capacitive or resistive load.
Available in a choice of space-saving packages, the LPV7215 is ideal for use in handheld electronics and mobile phone applications. The LPV7215 is manufactured with TI's advanced VIP50 process.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LPV7215 Micropower, CMOS Input, RRIO, 1.8-V, Push-Pull Output Comparator datasheet (Rev. J) | PDF | HTML | 2016年 8月 31日 |
Application brief | Headphone Jack Detection in Personal Electronics Using Comparators | 2018年 2月 9日 | ||
Application note | Nano-Power Battery Monitoring in Personal Electronics | 2017年 12月 8日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 與 SOT23-6)
- DCK(SC70-5 與 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。