PGA309-HT
- Complete Bridge Sensor Conditioner
- Voltage Output: Ratiometric or Absolute
- Digital Cal: No Potentiometers/Sensor Trims
- Sensor Error Compensation
- Span, Offset, and Temperature Drifts
- Low Error, Time-Stable
- Sensor Linearization Circuitry
- Temperature Sense: Internal or External
- Calibration Lookup Table Logic
- Uses External EEPROM (SOT23-5)
- Over/Under-Scale Limiting
- Sensor Fault Detection
- +2.7V TO +5.5V Operation
- Small TSSOP-16 Package
The PGA309 is a programmable analog signal conditioner designed for bridge sensors. The analog signal path amplifies the sensor signal and provides digital calibration for zero, span, zero drift, span drift, and sensor linearization errors with applied stress (pressure, strain, etc.). The calibration is done via a One-Wire digital serial interface or through a Two-Wire industry-standard connection. The calibration parameters are stored in external nonvolatile memory (typically SOT23-5) to eliminate manual trimming and achieve long-term stability.
The all-analog signal path contains a 2x2 input multiplexer (mux), auto-zero programmable-gain instrumentation amplifier, linearization circuit, voltage reference, internal oscillator, control logic, and an output amplifier. Programmable level shifting compensates for sensor dc offsets.
The core of the PGA309 is the precision, low-drift, no 1/f noise Front-End PGA (Programmable Gain Amplifier). The overall gain of the Front-End PGA + Output Amplifier can be adjusted from 2.7V/V to 1152V/V. The polarity of the inputs can be switched through the input mux to accommodate sensors with unknown polarity output. The Fault Monitor circuit detects and signals sensor burnout, overload, and system fault conditions.
For reference application information, see the commercial device PGA309 User's Guide (SBOU024) available for download at www.ti.com.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Voltage Output Programmable Sensor Conditioner, PGA309-HT datasheet (Rev. A) | 2013年 12月 26日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點