SN74AUC2G66

Name: SN74AUC2G66
Brand: TI
SKU: SN74AUC2G66
Price: 0.164 USD

現行

2.5-V、1:1 (SPST)、2 通道類比開關

立即訂購

產品規格表

document-pdfAcrobat SN74AUC2G66 datasheet (Rev. A) (英文)

SN74AUC2G66

現行

產品規格表

立即訂購

產品詳細資料

Configuration

1:1 SPST

Number of channels

Power supply voltage - single (V)

0.8, 1.2, 1.8, 2.5

Protocols

Analog

Ron (typ) (Ω)

CON (typ) (pF)

ON-state leakage current (max) (µA)

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (A)

0.05

Rating

Catalog

Drain supply voltage (max) (V)

2.7

Supply voltage (max) (V)

2.7

Configuration

1:1 SPST

Number of channels

Power supply voltage - single (V)

0.8, 1.2, 1.8, 2.5

Protocols

Analog

Ron (typ) (Ω)

CON (typ) (pF)

ON-state leakage current (max) (µA)

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (A)

0.05

Rating

Catalog

Drain supply voltage (max) (V)

2.7

Supply voltage (max) (V)

2.7

DSBGA (YZP)

2.8125 mm² 2.25 x 1.25

SSOP (DCT)

11.8 mm² 2.95 x 4

VSSOP (DCU)

6.2 mm² 2 x 3.1

Available in the Texas Instruments NanoFree™ Package
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Max t_pd of 0.5 ns at 1.8 V
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

Available in the Texas Instruments NanoFree™ Package
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Max t_pd of 0.5 ns at 1.8 V
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

This dual analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC operation.

The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

This dual analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC operation.

The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

filter

尋找其它類比與精密開關與多工器

下載觀看有字幕稿的影片影片

技術文件

star

=TI 所選的此產品重要文件

找不到結果。請清除您的搜尋條件，然後再試一次。

檢視所有 19

	類型	標題		日期
*	Data sheet	SN74AUC2G66 datasheet (Rev. A)		2007年 1月 15日
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	2022年 6月 2日
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	2021年 12月 1日
	Selection guide	Little Logic Guide 2018 (Rev. G)		2018年 7月 6日
	Application note	How to Select Little Logic (Rev. A)		2016年 7月 26日
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		2015年 12月 2日
	User guide	LOGIC Pocket Data Book (Rev. B)		2007年 1月 16日
	Product overview	Design Summary for WCSP Little Logic (Rev. B)		2004年 11月 4日
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		2004年 7月 8日
	Application note	Selecting the Right Level Translation Solution (Rev. A)		2004年 6月 22日
	User guide	Signal Switch Data Book (Rev. A)		2003年 11月 14日
	Application note	Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices		2003年 3月 21日
	User guide	AUC Data Book, January 2003 (Rev. A)		2003年 1月 1日
	Application note	Texas Instruments Little Logic Application Report		2002年 11月 1日
	Application note	TI IBIS File Creation, Validation, and Distribution Processes		2002年 8月 29日
	More literature	Standard Linear & Logic for PCs, Servers & Motherboards		2002年 6月 13日
	More literature	STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS		2002年 3月 27日
	More literature	AUC Product Brochure (Rev. A)		2002年 3月 18日
	Selection guide	Logic Guide (Rev. AC)	PDF \| HTML	1994年 6月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

DIP-ADAPTER-EVM — DIP 轉接器評估模組

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

使用指南: PDF

TI.com 無法提供

介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADED1 板可用於快速測試和搭建 TI 常見的有引腳封裝此電路板具備板上配置，可將 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面黏著封裝轉換為 100mil DIP 排針。

使用指南: PDF

TI.com 無法提供

介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。此電路板具有封裝設計，可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。

使用指南: PDF