SN74AUP2G14
- Available in the Texas Instruments NanoStar™ package
- Low static-power consumption (ICC = 0.9µA maximum)
- Low dynamic-power consumption (Cpd = 4.3pF typical at 3.3V)
- Low input capacitance (Ci = 1.5pF typical)
- Low noise – overshoot and undershoot <10% of VCC
- Ioff supports partial-power-down mode operation
- Wide operating VCC range of 0.8V to 3.6V
- Optimized for 3.3V operation
- 3.6V I/O tolerant to support mixed-mode signal Operation
- tpd = 4.3ns maximum at 3.3V
- Suitable for point-to-point applications
- Latch-up performance exceeds 100mA Per JESD 78, Class II
- ESD performance tested per JESD 22
- 2000V human-body model (A114-B, Class II)
- 1000V charged-device model (C101)
The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8V to 3.6V, resulting in increased battery life (see Figure 5-1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 5-2).
The SN74AUP2G14 contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN74AUP2G14 Low-Power Dual Schmitt-Trigger Inverter datasheet (Rev. D) | PDF | HTML | 2025年 6月 1日 |
| Selection guide | Logic Guide (Rev. AC) | PDF | HTML | 2025年 11月 13日 | |
| Application brief | Understanding Schmitt Triggers (Rev. B) | PDF | HTML | 2025年 4月 17日 | |
| Selection guide | Little Logic Guide 2018 (Rev. G) | 2018年 7月 6日 | ||
| Application note | How to Select Little Logic (Rev. A) | 2016年 7月 26日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
5-8-NL-LOGIC-EVM — 支援 5 至 8 針腳 DPW、DQE、DRY、DSF、DTM、DTQ 和 DTT 封裝的通用邏輯和轉譯 EVM
支援任何具 DTT、DRY、DPW、DTM、DQE、DQM、DSF 或 DTQ 封裝的邏輯或轉換裝置之通用 EVM。可實現靈活評估的電路板設計。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YFP) | 6 | Ultra Librarian |
| SOT-SC70 (DCK) | 6 | Ultra Librarian |
| USON (DRY) | 6 | Ultra Librarian |
| X2SON (DSF) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點