TLV1872
- Wide supply range: 2.7V to 40V (±1.35V to ±20V)
- Single or split supplies operation
- "Floating" push-pull output with separate supplies
- Output supplies set the full output swing.
- Rail-to-rail input
- Power-on-reset (POR)
- 65ns propagation delay
- Low input offset voltage: 500µV
- Low supply current: 70µA per channel
- Temperature range: -40°C to +125°C
The TLV187x is a 40V high-speed comparator that offers rail-to-rail inputs with a push-pull output-stage. The TLV187x also has the ability to level shift via separate input and output supplies. These features coupled with 65ns propagation delay make this family well-suited for bipolar zero-cross detection, Class D audio amplifier systems or other applications where level translation and propagation delay symmetry is needed.
This device includes a Power-On Reset (POR) feature that makes sure the output is in a known state until the minimum supply voltage has been reached before the output responds to the inputs, thus preventing false outputs during system power-up and power-down.
The TLV187x has a push-pull output stage, making them an excellent choice for applications where symmetry between rising and falling output responses is desired. This device offers the ability to level translate for downstream devices at lower voltages due to the separate input and output supplies.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV1871/2 40V High-Speed Comparator with Separate Input and Output Supplies datasheet | PDF | HTML | 2024年 3月 20日 |
Product overview | Optimizing High-Speed, High-Voltage Control Loops with Comparators | PDF | HTML | 2024年 5月 7日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TLV1872EVM — TLV1872 評估模組
此板為用於評估 40V 雙通道 TLV1872 比較器的評估模組。EVM 可將 10 針腳 DGS 封裝轉換為 10 針腳 DIP 封裝,藉此簡化原型設計程序,使在有測試電路和模擬電路之必要時能輕鬆進行。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
VSSOP (DGS) | 10 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。