TLV6722
- Compliant with OSFP and OSFP-XD MSAs
- Precision integrated resistors
- Integrated reference
- Dual comparators
- M_RSTn: Open-drain output
- M_LPWn: Push-pull output
- Internal hysteresis
- Integrated clock buffer (TLV6723 and TLV6724)
- Known start-up conditions
- Separate host and module supplies:
- H_VCC: 3.135V to 3.465V
- M_VCC: 1.1V to H_VCC
- -25°C to 105°C operating temperature range
- Small size package:
- 1.2mm x 1.2mm DSBGA-9 (YBJ)
The TLV672x are a family of devices that fully integrates the module-side INT/RSTn and LPWn/PRSn(/ePPS) circuits as defined by the OSFP and OSFP-XD MSAs. The TLV672x integrates all devices and passives for the INT/RSTn and LPWn/PRsn(/ePPS) circuits into a small-size 1.2mm x 1.2mm DSBGA-9 package. This makes the TLV672x well-suited for space-critical OSFP and OSFP-XD module designs.
The TLV672x contains integrated resistors and voltage reference that are factory-trimmed per the specifications of the OSFP and OSFP-XD MSAs, making sure that the host-to-module interface voltages and comparator switching thresholds are within the proper voltage zones.
The M_LPWn comparator within the TLV672x has a push-pull output that is capable of being powered by a separate voltage supply (M_VCC). This allows for level-shifting of host-to-module logic levels without the need of a discrete pull-up resistor. The M_RSTn comparator within the TLV672x has an open-drain output allowing for easy OR-ing of multiple reset signal drivers.
The TLV6723 and TLV6724 have an integrated clock buffer that can support an embedded pulse-per-second or reference clock signal up to 156.25MHz as defined on the OSFP-XD MSA. Whenever the M_LPWn signal is low (asserted true), the integrated clock buffer on the TLV6723 enters a self-shutdown mode, lowering the quiescent current and saving power.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TLV672x OSFP/OSFP-XD Module Low-Speed Signals Controller with ePPS Support datasheet | PDF | HTML | 2025年 12月 22日 |
設計與開發
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TLV672XEVM — TLV672x 評估模組
TLV672X 評估模組 (EVM) 是可評估 TLV6722 主要功能與性能的平台。TLV6722 裝置將 OSFP 模組側 INT/RSTn 和 LPWn/PRSn 電路整合至小型 DSBGA-9 (YBJ) 封裝中。TLV672XEVM 支援 OSFP 主機端組件以示範 TLV6722 的應用程式內功能。
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TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YBJ) | 9 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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