產品詳細資料

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44, 50 Power supply voltage - dual (V) +/- 25, +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.35 CON (typ) (pF) 24 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (A) 0.45 Rating Catalog Drain supply voltage (max) (V) 25 Supply voltage (max) (V) 50 Negative rail supply voltage (max) (V) -25
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44, 50 Power supply voltage - dual (V) +/- 25, +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.35 CON (typ) (pF) 24 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 150 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (A) 0.45 Rating Catalog Drain supply voltage (max) (V) 25 Supply voltage (max) (V) 50 Negative rail supply voltage (max) (V) -25
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Dual supply range: ±4.5V to ±25V
  • Single supply range: 4.5V to 50V
  • Asymmetric dual supply support (For example: VDD = 37.5V, VSS = -12.5V)
  • 1.8V logic compatible
  • Precision performance:
    • Low on-resistance: 1.1Ω (typical)
    • Low capacitance: 27pF (typical)
    • Ultra-low on-resistance flatness: 0.0003Ω (typical)
    • High current support: 470mA (maximum)
    • Low on-leakage current: 3.7pA (typical), 0.3nA (maximum)
    • Low off-leakage current: 30pA (typical), 0.15nA (maximum)
    • Ultra-low charge injection: 2pC (typical)
  • –40°C to +125°C operating temperature
  • Rail-to-rail operation
  • Bidirectional operation
  • Break-before-make switching
  • Dual supply range: ±4.5V to ±25V
  • Single supply range: 4.5V to 50V
  • Asymmetric dual supply support (For example: VDD = 37.5V, VSS = -12.5V)
  • 1.8V logic compatible
  • Precision performance:
    • Low on-resistance: 1.1Ω (typical)
    • Low capacitance: 27pF (typical)
    • Ultra-low on-resistance flatness: 0.0003Ω (typical)
    • High current support: 470mA (maximum)
    • Low on-leakage current: 3.7pA (typical), 0.3nA (maximum)
    • Low off-leakage current: 30pA (typical), 0.15nA (maximum)
    • Ultra-low charge injection: 2pC (typical)
  • –40°C to +125°C operating temperature
  • Rail-to-rail operation
  • Bidirectional operation
  • Break-before-make switching

The TMUX7612 is a complementary metal-oxide semiconductor (CMOS) switch device with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The device works with a single supply (4.5V to 50V), dual supplies (±4.5V to ±25V), or asymmetric supplies (such as VDD = 37.5V, VSS = –12.5V). The TMUX7612 supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

The switches of the TMUX7612 are controlled with appropriate logic control inputs on the SELx pins. The TMUX7612 features a special architecture which allows for ultra-low charge injection. This feature helps prevent unwanted coupling from the control input to the analog output of the device and reduces AC noise and offset errors.

The TMUX7612 is a part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

The TMUX7612 is a complementary metal-oxide semiconductor (CMOS) switch device with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The device works with a single supply (4.5V to 50V), dual supplies (±4.5V to ±25V), or asymmetric supplies (such as VDD = 37.5V, VSS = –12.5V). The TMUX7612 supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

The switches of the TMUX7612 are controlled with appropriate logic control inputs on the SELx pins. The TMUX7612 features a special architecture which allows for ultra-low charge injection. This feature helps prevent unwanted coupling from the control input to the analog output of the device and reduces AC noise and offset errors.

The TMUX7612 is a part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4
類型 標題 日期
* Data sheet TMUX7612 50V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8V Logic datasheet (Rev. A) PDF | HTML 2024年 12月 6日
Application note Understanding THD and THD+N in Multiplexer Applications PDF | HTML 2025年 9月 25日
Application note Key Voltage Considerations for Replacing a Photorelay With an Analog Switch PDF | HTML 2025年 3月 10日
Application note When to Replace a Relay With a Multiplexer (Rev. A) PDF | HTML 2024年 6月 7日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TMUX-24PW-EVM — 適用於 16 針腳、20 針腳和 24 針腳 PW 薄型收縮小外形封裝 (TSSOP) 的 TMUX 通用評估模組

TMUX-24PW-EVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析,這些產品使用 16、20 或 24 針腳 TSSOP 封裝 (PW),並且額定用於高電壓操作。

使用指南: PDF | HTML
TI.com 無法提供
開發板

TMUXRUM-RRPEVM — 適用於 16 針腳 RUM 和 RRP 四方扁平無引線 (QFN) 封裝的 TMUX 通用評估模組

TMUXRUM-RRPEVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析,這些產品使用 16 接腳 RUM 或 RRP 封裝 (QFN),並且額定用於高電壓操作。

使用指南: PDF | HTML
TI.com 無法提供
介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADED1 板可用於快速測試和搭建 TI 常見的有引腳封裝  此電路板具備板上配置,可將 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面黏著封裝轉換為 100mil DIP 排針。     

使用指南: PDF
TI.com 無法提供
介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。  此電路板具有封裝設計,可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
使用指南: PDF
TI.com 無法提供
模擬型號

TMUX7612 IBIS Model

SCDM325.ZIP (30 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片