開發模組 (EVM) 的 GUI
TS3A227E
- Supple Range of 2.5 V to 4.5 V
- Accessory Insertion/Removal Detection with
Adjustable De-bounce Timings - Accessory Configuration Detection:
- Stereo 3-pole Headphone
- 4-pole Standard Headset with MIC on Sleeve
- 4-pole OMTP Headset with MIC on Ring2
- Key Press Detection for Up to 4 Keys
- Ultra Low Ground FET RON of 60 mΩ
- Power Off Noise Removal
- Isolation of MICBIAS From Audio Jack to Remove
Click/Pop Noise - Integrated Codec Sense Line
- Manual I2C Control
- FM Transmission Capability
- Dual Small Package Options
- 16 Pin DSBGA
- 16 Pin QFN
The TS3A227E is an autonomous audio accessory detection and configuration switch that detects 3-pole or 4-pole audio accessories and configures internal switches to route the signals accordingly.
The internal ground FETS of the TS3A227E have an ultra-low RON of 60 mΩ to minimize crosstalk impact. The ground FETs are also designed to pass FM signals, making it possible to use the ground line of the accessory as an FM antenna in mobile audio applications.
Internal isolation switches allow the TS3A227E to remove the click/pop noise that can be generated during and insertion or removal of an audio accessory. In addition depletion FETs prevent a floating ground while the device is unpowered, removing the humming noise present when leaving accessories plugged into an unpowered system.
A low-power sleep mode is provided which shuts down internal circuitry to achieve very low quiescent current draw when no headset is inserted.
The TS3A227E features integrated key press detection for detecting up to 4 keys with press and release support.
Manual I2C control allows the TS3A227E to adapt to application needs by providing control over de-bounce settings and switch states.
技術文件
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檢視所有 4 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TS3A227E Autonomous Audio Accessory Detection and Configuration Switch datasheet (Rev. B) | PDF | HTML | 2015年 2月 5日 |
| Application note | Support Selfie Sticks Using a TS3A227E Audio Jack Switch | 2016年 3月 4日 | ||
| Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
TS3A227E-EVM — TS3A227E 評估模組
TS3A227E-EVM 是一款適用於 TI 自動音訊配件開關的評估模組，具備可調整去抖動設定、超低 RON 接地 FET、耗盡型 FET、按鍵偵測及手動 I2C 控制等功能。 此模組可讓您輕鬆評估裝置性能和功能。搭配此裝置使用 LaunchPad™ 開發套件介面時，EVM 也可做為建立韌體的開發平台。
使用指南: PDF
驅動程式或資料庫
TS3A227ESW-LINUX — 適用於 TS3A227E 的 Linux 驅動程式
The Linux driver supports the TS3A227E Autonomous Audio Accessory Detection and Configuration Switch. The Linux driver supports communication through the I2C bus and interfaces with the Linux Sound SoC Component framework.
Linux Mainline Status
Available in Linux Main line: Yes
Available through (...)
參考設計
TIDA-00565 — USB Type-C 音訊轉接器配件模式參考設計
USB Type-C™ 音訊轉接器配件模式參考設計提供透過 USB Type-C 介面傳送類比音訊的解決方案。 此參考設計展示如何使用 USB Type-C 標準音訊轉接器配件模式將類比音訊傳送至系統週邊設備，同時依然能夠透過相同的 USB Type-C 連接器傳輸 USB 資料。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YFF) | 16 | Ultra Librarian |
| VQFN (RVA) | 16 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。