TS3A24157
- Specified Break-Before-Make Switching
- Low ON-State Resistance (0.65-Ω Maximum)
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion
- 1.65-V to 3.6-V Single-Supply Operation
- Bidirectional Signal Paths
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS3A24157 0.65-Ω 2-Channel SPDT Analog Switch 2-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. B) | PDF | HTML | 2016年 10月 12日 |
Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022年 7月 26日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。