產品詳細資料

Bits (#) 2 Data rate (max) (Mbps) 100 Topology Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.2 Vin (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 5.5 Applications GPIO, SPI, UART Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Technology family TXB Supply current (max) (mA) 0.008 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 2 Data rate (max) (Mbps) 100 Topology Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.2 Vin (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 5.5 Applications GPIO, SPI, UART Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Technology family TXB Supply current (max) (mA) 0.008 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On B Port (V CCA ≤ V CCB)
  • V CC Isolation Feature – If Either V CC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to V CCA
  • Low Power Consumption, 4-µA Max I CC
  • I off Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On B Port (V CCA ≤ V CCB)
  • V CC Isolation Feature – If Either V CC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to V CCA
  • Low Power Consumption, 4-µA Max I CC
  • I off Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection datasheet (Rev. E) PDF | HTML 2023年 10月 17日
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024年 7月 12日
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
Application note Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 2023年 9月 29日
Application note Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 2023年 6月 28日
Selection guide Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
Application note Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) 2018年 3月 28日
Application note Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices 2017年 11月 19日
Application note Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators 2017年 10月 30日
Application note A Guide to Voltage Translation With TXS-Type Translators 2010年 6月 29日
Application note A Guide to Voltage Translation With TXB-Type Translators 2010年 3月 3日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組

靈活的 EVM 旨在支援任何針腳數為 5 至 8 支且採用 DCK、DCT、DCU、DRL 或 DBV 封裝的裝置。
使用指南: PDF
TI.com 無法提供
開發板

TXB-EVM — 1 至 8 位元 TXB 轉換器系列評估模組

此 EVM 專為支援 TXB 自動雙向系列的單通道、雙通道、四通道及八通道裝置而設計。TXB 裝置屬於自動雙向轉換系列,操作電壓範圍設計於 1.2V 至 5.5V 之間的電平轉換。
使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TXB0102 IBIS Model (Rev. A)

SCEM563A.ZIP (71 KB) - IBIS Model
參考設計

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電路圖: PDF
參考設計

TIDA-00403 — 使用 TLV320AIC3268 miniDSP 轉碼器的超音波距離量測參考設計

TIDA-00403 參考設計使用針對超音波距離量測解決方案的現成 EVM,該解決方案使用 TLV320AIC3268 miniDSP 中的演算法。與 TI 的 PurePath Studio 設計套件搭配使用,只需按滑鼠即可設計穩固且使用者可配置的超音波距離量測系統。使用者可修改超音波突衝產生特性和偵測演算法,以配合工業和測量應用的特定使用案例,讓使用者能夠克服其他固定功能感測器的限制,同時提高量測可靠性。TLV320AIC3268 上的兩個 GPIO 會自動觸發,表示發射與接收的超音波突衝。透過監控這些 GPIO 的主機 MCU,即可擷取飛行時間。
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YZP) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian

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  • 產品標記
  • 鉛塗層/球物料
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  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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