TXG4122
- Bidirectional I2C compatible communication
- Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
- Supports DV shifts up to ±40V
- Data rate up to 1MHz
- Side 1 Supply Range: 3V to 5.5V
- Side 2 Supply Range: 2.25V to 5.5V
- Maximum capacitive load:
- 80pF (Side 1) and 550pF (Side 2)
- Open -drain outputs with current sink capability:
- 16.5mA (Side 1) and 30mA (Side 2)
- Low power consumption at 400kHz (typical):
- ICC1 = 4.2mA, ICC2 = 0.9mA
- Operating temperature from –40°C to +125°C
- CMTI of 2kV/µs
- Latch-up performance exceeds 100mA per JESD 78, class II
- ESD protection exceeds JESD 22
- 2000V human-body model
- 500V charged-device model
- Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)
The TXG4122 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG4122 can solve the challenges of voltage translation across different ground levels up to ±40V. Both GND1 or GND2 can have an offset ground as long as the difference between GND1 and GND2 remains -40V to +40V.
The Simplified Block Diagram shows a common use case where DC shift occurs between GND1 to GND2 due to parasitic resistance or capacitance. The TXG4122 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GND1 and GND2 is typically 25nA when VCC to GND is shorted.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TXG4122 ± 40V Bidirectional Ground-Level Translator for I2C datasheet | PDF | HTML | 2026年 6月 15日 |
設計與開發
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TXG-4CH-EVM — 適用於 4 通道接地位準轉換器的 TXG 評估模組
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點