UC1611-SP
- Matched, Four-Diode Monolithic Array
- High Peak Current
- Low-Cost MINIDIP Package
- Low-Forward Voltage
- Parallelable for Lower VF or Higher IF
- Fast Recovery Time
- Military Temperature Range Available
This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | Quad Schottky Diode Array datasheet (Rev. A) | 2001/5/15 | |||
| * | SMD | UC1611-SP SMD 5962-90538 | 2016/7/8 | |||
| 選擇指南 | TI Space Products (Rev. L) | 2026/3/27 | ||||
| 應用說明 | Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form (Rev. A) | PDF | HTML | 2025/11/5 | |||
| Application brief | DLA Approved Optimizations for QML Products (Rev. C) | PDF | HTML | 2025/6/17 | |||
| 應用說明 | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. B) | PDF | HTML | 2025/6/10 | |||
| 更多文件說明 | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) | 2025/2/20 | ||||
| 應用說明 | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022/10/19 | |||
| 應用說明 | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/8/18 | |||
| 使用指南 | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021/9/27 | |||
| 應用說明 | DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer | 2020/8/21 | ||||
| 電子書 | Radiation Handbook for Electronics (Rev. A) | 2019/5/21 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 適用於 ESD 二極體封裝的通用評估模組，包括 0402、0201等
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| LCCC (FK) | 20 | Ultra Librarian |
| CDIP (JG) | 8 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。