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74LVC2G125DCURG4 ACTIVE

Dual Bus Buffer Gate with 3-State Outputs

Same as: 74LVC2G125DCURE4   This part number is identical to the part number listed above. You can only order quantities of the part number listed above.

NEW - Custom reel may be available
Inventory: 7,000  
 

Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material NIPDAU
MSL rating / Peak reflow Level-1-260C-UNLIM
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (℃)
VSSOP (DCU) | 8 3,000 | LARGE T&R
Custom reel may be available
-40 to 125
Package | Pins VSSOP (DCU) | 8
Package qty | Carrier: 3,000 | LARGE T&R
Custom reel may be available
Operating temperature range (℃) -40 to 125
View TI packaging information

Features for the SN74LVC2G125

  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.3 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
    to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II

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Description for the SN74LVC2G125

The SN74LVC2G125 device is a dual bus buffer gate, designed for 1.65-V to 5.5-VVCC operation. This device features dual line drivers with 3-state outputs.The outputs are disabled when the associated output-enable (OE) input ishigh.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using thedie as the package.

To ensure the high-impedance state during power up or power down,OE should be tied to VCC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of thedriver.

This device is fully specified for partial-power-down applications usingIoff. The Ioff circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.

Pricing


Qty Price (USD)
1-99 0.402
100-249 0.273
250-999 0.211
1,000+ 0.14