SLUSE99C September   2021  – January 2023 BQ25180

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Battery Charging Process
        1. 8.1.1.1 Trickle Charge
        2. 8.1.1.2 Precharge
        3. 8.1.1.3 Fast Charge
        4. 8.1.1.4 Termination
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 8.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 8.3.3  Battery Supplement Mode
      4. 8.3.4  SYS Power Control (SYS_MODE bit control)
        1. 8.3.4.1 SYS Pulldown Control
      5. 8.3.5  SYS Regulation
      6. 8.3.6  ILIM Control
      7. 8.3.7  Protection Mechanisms
        1. 8.3.7.1 Input Overvoltage Protection
        2. 8.3.7.2 Battery Undervoltage Lockout
        3. 8.3.7.3 System Overvoltage Protection
        4. 8.3.7.4 System Short Protection
        5. 8.3.7.5 Battery Overcurrent Protection
        6. 8.3.7.6 Safety Timer and Watchdog Timer
        7. 8.3.7.7 Thermal Protection and Thermal Regulation
      8. 8.3.8  Pushbutton Wake and Reset Input
        1. 8.3.8.1 Pushbutton Wake or Short Button Press Functions
        2. 8.3.8.2 Pushbutton Reset or Long Button Press Functions
      9. 8.3.9  15-Second Timeout for HW Reset
      10. 8.3.10 Hardware Reset
      11. 8.3.11 Software Reset
      12. 8.3.12 Interrupt Indicator (/INT) Pin
      13. 8.3.13 External NTC Monitoring (TS)
        1. 8.3.13.1 TS Biasing and Function
      14. 8.3.14 I2C Interface
        1. 8.3.14.1 F/S Mode Protocol
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 I2C Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input (IN/SYS) Capacitors
        2. 9.2.2.2 TS
        3. 9.2.2.3 Recommended Passive Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input Voltage IN -0.3 25 V
Voltage All other pins -0.3 5.5 V
Input Current (DC) IN 1.1 A
SYS Discharge Current(DC) SYS 1.5 A
SYS Discharge Current (tpulse <20ms) SYS 2.5 A
Output Sink Current /INT 20 mA
TJ Junction temperature -40 150 °C
Tstg Storage temperature -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.