SLVSGI9A october   2022  – july 2023 DRV8411A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1.     Pin Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 External Components
    4. 9.4 Feature Description
      1. 9.4.1 Bridge Control
      2. 9.4.2 Current Sense and Regulation
        1. 9.4.2.1 Current Sensing
        2. 9.4.2.2 Current Regulation
      3. 9.4.3 Protection Circuits
        1. 9.4.3.1 Overcurrent Protection (OCP)
        2. 9.4.3.2 Thermal Shutdown (TSD)
        3. 9.4.3.3 Undervoltage Lockout (UVLO)
    5. 9.5 Device Functional Modes
      1. 9.5.1 Active Mode
      2. 9.5.2 Low-Power Sleep Mode
      3. 9.5.3 Fault Mode
    6. 9.6 Pin Diagrams
      1. 9.6.1 Logic-Level Inputs
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Stepper Motor Application
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
            1. 10.1.1.1.2.1 Stepper Motor Speed
            2. 10.1.1.1.2.2 Current Regulation
            3. 10.1.1.1.2.3 Stepping Modes
              1. 10.1.1.1.2.3.1 Full-Stepping Operation
              2. 10.1.1.1.2.3.2 Half-Stepping Operation with Fast Decay
              3. 10.1.1.1.2.3.3 Half-Stepping Operation with Slow Decay
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 Dual BDC Motor Application
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
            1. 10.1.1.2.2.1 Motor Voltage
            2. 10.1.1.2.2.2 Current Regulation
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Thermal Considerations
          1. 10.1.1.3.1 Maximum Output Current
          2. 10.1.1.3.2 Power Dissipation
          3. 10.1.1.3.3 Thermal Performance
            1. 10.1.1.3.3.1 Steady-State Thermal Performance
            2. 10.1.1.3.3.2 Transient Thermal Performance
  12. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
    2. 11.2 Power Supply and Logic Sequencing
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Functions

PINTYPE(1)DESCRIPTION
NAMERTEPWP
AIN11416IH-bridge control input for full bridge A (AOUT1, AOUT2). See Section 9.4.1. Internal pulldown resistor.
AIN21315IH-bridge control input for full bridge A (AOUT1, AOUT2). See Section 9.4.1. Internal pulldown resistor.
AIPROPI1214OAnalog current output proportional to load current for full bridge A (AOUT1, AOUT2). See Section 9.4.2.
AOUT1162OBridge A output 1
AOUT224OBridge A output 2
BIN179IH-bridge control input for full bridge B (BOUT1, BOUT2). See Section 9.4.1. Internal pulldown resistor.
BIN2810IH-bridge control input for full bridge B (BOUT1, BOUT2). See Section 9.4.1. Internal pulldown resistor.
BIPROPI911OAnalog current output proportional to load current for full bridge B (BOUT1, BOUT2). See Section 9.4.2.
BOUT157OBridge B output 1
BOUT235OBridge B output 2
GND1113PWRDevice ground. Connect to system ground.
nFAULT68ODFault indicator output. Pulled low during a fault condition. Connect an external pullup resistor for open-drain operation. See Section 9.4.3.
PAD———Thermal pad. Connect to system ground.
PGNDA13PWRDevice power ground for full bridge A (AOUT1, AOUT2). Connect to system ground.
PGNDB46PWRDevice power ground for full bridge B (BOUT1, BOUT2). Connect to system ground.
VM1012PWR1.65-V to 11-V power supply input. Connect a 0.1-µF bypass capacitor to ground, as well as sufficient Bulk Capacitance rated for VM.
VREF151IExternal reference voltage input to set internal current regulation limit..See Section 9.4.2.
(1) PWR = power, I = input, O = output, NC = no connection, OD = open-drain