SBOSAM2 August   2025 INA701

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Shunt Resistor
      2. 6.3.2 Safe Operating Area
      3. 6.3.3 Versatile Measurement Capability
      4. 6.3.4 Internal Measurement and Calculation Engine
      5. 6.3.5 High-Precision Delta-Sigma ADC
        1. 6.3.5.1 Low Latency Digital Filter
        2. 6.3.5.2 Flexible Conversion Times and Averaging
      6. 6.3.6 Integrated Precision Oscillator
      7. 6.3.7 Multi-Alert Monitoring and Fault Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Power-On Reset
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 Writing to and Reading Through the I2C Serial Interface
        2. 6.5.1.2 High-Speed I2C Mode
        3. 6.5.1.3 SMBus Alert Response
    6. 6.6 Register Maps
      1. 6.6.1 INA701 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Device Measurement Range and Resolution
      2. 7.1.2 ADC Output Data Rate and Noise Performance
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Configure the Device
        2. 7.2.2.2 Set Desired Fault Thresholds
        3. 7.2.2.3 Calculate Returned Values
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YWF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.2 Safe Operating Area

The power dissipated in the device limits the maximum current that can be safely handled by the device. The current consumed to power the device is low, therefore the primary source of heating is due to the current flow through the internal shunt resistor. The maximum safe-operating current level shown in Figure 6-4 is set so that the heat generated in the package is limited and the internal junction temperature of the silicon does not exceed 125°C. This data is collected from an evaluation module that uses a 2-layer board with 1oz copper power planes to the INA701 IN+ and IN– pins.

INA701 Maximum Shunt Current vs Temperature Figure 6-4 Maximum Shunt Current vs Temperature
CAUTION: The INA701 has a maximum junction of 125°C which must not be exceeded. Operation above 125°C can result in permanent damage to the device.

The current measurement capability is limited by ADC full scale range of 6.225A, even though the shunt can withstand pulse currents greater than 6A.

In applications with overcurrent transients, the peak amplitude and duration of the overcurrent event is important to determine the device heating. Figure 6-5 shows the peak pulse current versus pulse duration that the device can withstand before the maximum junction temperature of 125°C is exceeded. The data shown in this curve is collected at TA = 25°C, using the INA701 evaluation module.

INA701 Maximum Pulse Current vs Pulse Duration (Single Event) Figure 6-5 Maximum Pulse Current vs Pulse Duration (Single Event)