SNIS244 September   2025 ISOTMP35R

ADVANCE INFORMATION  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Thermal Information
   5. 5.5  Insulation Specification
   6. 5.6  Power Ratings
   7. 5.7  Safety-Related Certifications
   8. 5.8  Safety Limiting Values
   9. 5.9  Electrical Characteristics
   10. 5.10 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Features Description
      1. 6.3.1 Integrated Isolation Barrier and Thermal Response
      2. 6.3.2 Analog Output
         1. 6.3.2.1 Output Accuracy
         2. 6.3.2.2 Drive Capability
         3. 6.3.2.3 Common Mode Transient Immunity (CMTI)
      3. 6.3.3 Thermal Response
   4. 6.4 Device Functional Modes
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 External Buffer
      2. 7.1.2 ADC Interface Considerations
      3. 7.1.3 Electromagnetic Noise Mitigation
         1. 7.1.3.1 Filtering Techniques
         2. 7.1.3.2 General Design Guidelines
         3. 7.1.3.3 PCB Layout Practices
      4. 7.1.4 Insulation Lifetime
   2. 7.2 Power Supply Recommendations
      1. 7.2.1 PSRR Considerations
   3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
   2. 8.2 Receiving Notification of Documentation Updates
   3. 8.3 Support Resources
   4. 8.4 Trademarks
   5. 8.5 Electrostatic Discharge Caution
   6. 8.6 Glossary
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information