SNIS244 September   2025 ISOTMP35R

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Insulation Specification
    6. 5.6  Power Ratings
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Features Description
      1. 6.3.1 Integrated Isolation Barrier and Thermal Response
      2. 6.3.2 Analog Output
        1. 6.3.2.1 Output Accuracy
        2. 6.3.2.2 Drive Capability
        3. 6.3.2.3 Common Mode Transient Immunity (CMTI)
      3. 6.3.3 Thermal Response
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Buffer
      2. 7.1.2 ADC Interface Considerations
      3. 7.1.3 Electromagnetic Noise Mitigation
        1. 7.1.3.1 Filtering Techniques
        2. 7.1.3.2 General Design Guidelines
        3. 7.1.3.3 PCB Layout Practices
      4. 7.1.4 Insulation Lifetime
    2. 7.2 Power Supply Recommendations
      1. 7.2.1 PSRR Considerations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DFP|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply currentRθJA = 99.5°C/W, VI = 5V, TJ = 150°C, TA = 25°CTBDmA
PSSafety input, output, or total powerRθJA = 99.5°C/W, TJ = 150°C, TA = 25°CTBDW
TSMaximum safety temperature150℃
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power, respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the Thermal Information table is that of a device installed on a device evaluation board. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.