SNAS834 November   2024 LMK5C22212A

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagrams
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Differential Voltage Measurement Terminology
    2. 6.2 Output Clock Test Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 PLL Architecture Overview
      2. 7.2.2 DPLL
        1. 7.2.2.1 Independent DPLL Operation
        2. 7.2.2.2 Cascaded DPLL Operation
        3. 7.2.2.3 APLL Cascaded With DPLL
      3. 7.2.3 APLL-Only Mode
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator Input (XO)
      2. 7.3.2  Reference Inputs
      3. 7.3.3  Clock Input Interfacing and Termination
      4. 7.3.4  Reference Input Mux Selection
        1. 7.3.4.1 Automatic Input Selection
        2. 7.3.4.2 Manual Input Selection
      5. 7.3.5  Hitless Switching
        1. 7.3.5.1 Hitless Switching With Phase Cancellation
        2. 7.3.5.2 Hitless Switching With Phase Slew Control
      6. 7.3.6  Gapped Clock Support on Reference Inputs
      7. 7.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 7.3.7.1 XO Input Monitoring
        2. 7.3.7.2 Reference Input Monitoring
          1. 7.3.7.2.1 Reference Validation Timer
          2. 7.3.7.2.2 Frequency Monitoring
          3. 7.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 7.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 7.3.7.2.5 Phase Valid Monitor for 1-PPS Inputs
        3. 7.3.7.3 PLL Lock Detectors
        4. 7.3.7.4 Tuning Word History
        5. 7.3.7.5 Status Outputs
        6. 7.3.7.6 Interrupt
      8. 7.3.8  PLL Relationships
        1. 7.3.8.1  PLL Frequency Relationships
          1. 7.3.8.1.1 APLL Phase Frequency Detector (PFD) and Charge Pump
          2. 7.3.8.1.2 APLL VCO Frequency
          3. 7.3.8.1.3 DPLL TDC Frequency
          4. 7.3.8.1.4 DPLL VCO Frequency
          5. 7.3.8.1.5 Clock Output Frequency
        2. 7.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 7.3.8.3  APLL Reference Paths
          1. 7.3.8.3.1 APLL XO Doubler
          2. 7.3.8.3.2 APLL XO Reference (R) Divider
        4. 7.3.8.4  APLL Feedback Divider Paths
          1. 7.3.8.4.1 APLL N Divider With Sigma-Delta Modulator (SDM)
        5. 7.3.8.5  APLL Loop Filters (LF1, LF2)
        6. 7.3.8.6  APLL Voltage-Controlled Oscillators (VCO1, VCO2)
          1. 7.3.8.6.1 VCO Calibration
        7. 7.3.8.7  APLL VCO Clock Distribution Paths
        8. 7.3.8.8  DPLL Reference (R) Divider Paths
        9. 7.3.8.9  DPLL Time-to-Digital Converter (TDC)
        10. 7.3.8.10 DPLL Loop Filter (DLF)
        11. 7.3.8.11 DPLL Feedback (FB) Divider Path
      9. 7.3.9  Output Clock Distribution
      10. 7.3.10 Output Source Muxes
      11. 7.3.11 Output Channel Muxes
      12. 7.3.12 Output Dividers (OD)
      13. 7.3.13 Output Delay
      14. 7.3.14 Clock Outputs
        1. 7.3.14.1 Differential Output
        2. 7.3.14.2 LVCMOS Output
        3. 7.3.14.3 SYSREF/1PPS Output
      15. 7.3.15 Output Auto-Mute During LOL
      16. 7.3.16 Glitchless Output Clock Start-Up
      17. 7.3.17 Clock Output Interfacing and Termination
      18. 7.3.18 Output Synchronization (SYNC)
      19. 7.3.19 Zero-Delay Mode (ZDM)
      20. 7.3.20 DPLL Programmable Phase Delay
      21. 7.3.21 Time Elapsed Counter (TEC)
        1. 7.3.21.1 Configuring TEC Functionality
        2. 7.3.21.2 SPI as a Trigger Source
        3. 7.3.21.3 GPIO Pin as a TEC Trigger Source
          1. 7.3.21.3.1 An Example: Making a Time Elapsed Measurement Using TEC and GPIO1 as Trigger
        4. 7.3.21.4 Other TEC Behavior
    4. 7.4 Device Functional Modes
      1. 7.4.1 DPLL Operating States
        1. 7.4.1.1 Free-Run
        2. 7.4.1.2 Lock Acquisition
        3. 7.4.1.3 DPLL Locked
        4. 7.4.1.4 Holdover
      2. 7.4.2 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 7.4.2.1 DPLL DCO Control
        2. 7.4.2.2 DPLL DCO Relative Adjustment Frequency Step Size
        3. 7.4.2.3 APLL DCO Frequency Step Size
      3. 7.4.3 APLL Frequency Control
      4. 7.4.4 Device Start-Up
        1. 7.4.4.1 Device Power-On Reset (POR)
        2. 7.4.4.2 PLL Start-Up Sequence
        3. 7.4.4.3 Start-Up Options for Register Configuration
        4. 7.4.4.4 GPIO1 and SCS_ADD Functionalities
        5. 7.4.4.5 ROM Page Selection
        6. 7.4.4.6 EEPROM Overlay
      5. 7.4.5 Programming
        1. 7.4.5.1 Memory Overview
        2. 7.4.5.2 Interface and Control
          1. 7.4.5.2.1 Programming Through TICS Pro
          2. 7.4.5.2.2 SPI Serial Interface
          3. 7.4.5.2.3 I2C Serial Interface
        3. 7.4.5.3 General Register Programming Sequence
        4. 7.4.5.4 Steps to Program the EEPROM
          1. 7.4.5.4.1 Overview of the SRAM Programming Methods
          2. 7.4.5.4.2 EEPROM Programming With the Register Commit Method
          3. 7.4.5.4.3 EEPROM Programming With the Direct Writes Method or Mixed Method
          4. 7.4.5.4.4 Five MSBs of the I2C Address and the EEPROM Revision Number
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Start-Up Sequence
      2. 8.1.2 Power Down (PD#) Pin
      3. 8.1.3 Strap Pins for Start-Up
      4. 8.1.4 Pin States
      5. 8.1.5 ROM and EEPROM
      6. 8.1.6 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 8.1.6.1 Power-On Reset (POR) Circuit
        2. 8.1.6.2 Power Up From a Single-Supply Rail
        3. 8.1.6.3 Power Up From Split-Supply Rails
        4. 8.1.6.4 Non-Monotonic or Slow Power-Up Supply Ramp
      7. 8.1.7 Slow or Delayed XO Start-Up
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Supply Bypassing
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Reliability
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Glossary
    6. 9.6 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.4.5.2.2 SPI Serial Interface

When SPI control interface is selected, the device uses a 3-wire SPI with SDIO, SCK, and SCS signals (SPI_3WIRE_DIS = 0). When using SPI SCS_ADD also can act as a Time Elapsed Counter (TEC) trigger. When set SPI_3WIRE_DIS = 1, any GPIO can be selected as SDO to support readback with 4-wire SPI.

SPI and GPIO I/O are referenced to the 3.3-V power supply and the output drivers are 3.3-V LVCMOS compatible. The inputs are 1.8-V, 2.5-V, or 3.3-V LVCMOS compatible. When the SPI host is 3.3-V I/O, either 3-wire or 4-wire can be used without any voltage conversion. When the SPI host is not 3.3-V I/O complaint, the SDO signal from LMK5C22212A device must be divided to be compatible with the SPI host voltage level. The SDO pin can also be configured for open drain so the pullup resistors set the read back voltage as desired.

The host device must present data to the device MSB first. A message includes a transfer direction bit ( W/R), a 15-bit address field (A14 to A0), and a 8-bit data field (D7 to D0) as shown in Figure 7-44. The W/R bit is 0 for a SPI write and 1 for a SPI read.

LMK5C22212A SPI Message FormatFigure 7-44 SPI Message Format

A message frame is initiated by asserting SCS low. The frame ends when SCS is deasserted high. The first bit transferred is the W/R bit. The next 15 bits are the register address, and the remaining eight bits are data. On write transfers, data is committed in bytes as the final data bit (D0) is clocked in on the rising edge of SCK. If the write access is not an even multiple of eight clocks, the trailing data bits are not committed. On read transfers, data bits are clocked out from the SDO pin on the falling edges of SCK.

5.2.2.1 SPI Block Register Transfer

The LMK5C22212A supports a SPI block write and block read transfers. A SPI block transfer is exactly (2 + N) bytes long, where N is the number of data bytes to write or read. The host device (SPI host) is only required to specify the lowest address of the sequence of addresses to be accessed. The device automatically increments the internal register address pointer if the SCS pin remains low after the host finishes the initial 24-bit transmission sequence. Each transfer of eight bits (a data payload width) results in the device automatically incrementing the address pointer (provided the SCS pin remains active low for all sequences).