SBOS671D September 2018 – December 2022 OPA2828 , OPA828
PRODUCTION DATA
NAME | NO. | TYPE | DESCRIPTION |
---|---|---|---|
–IN | 2 | Input | Negative (inverting) input |
+IN | 3 | Input | Positive (noninverting) input |
NC | 1, 5, 8 | — | No internal connection (can be left floating or grounded) |
OUT | 6 | Output | Output |
V+ | 7 | — | Positive (highest) power supply |
V– | 4 | — | Negative (lowest) power supply |
Thermal Pad(1) | — | — | Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the thermal pad to V− or ground to minimize leakage to the input pins |
NAME | NO. | TYPE | DESCRIPTION |
---|---|---|---|
–IN A | 2 | Input | Negative (inverting) input A |
+IN A | 3 | Input | Positive (noninverting) input A |
–IN B | 6 | Input | Negative (inverting) input B |
+IN B | 5 | Input | Positive (noninverting) input B |
OUT A | 1 | Output | Output A |
OUT B | 7 | Output | Output B |
V+ | 8 | — | Positive (highest) power supply |
V– | 4 | — | Negative (lowest) power supply |
Thermal Pad(1) | — | — | Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the thermal pad to V− or ground to minimize leakage to the input pins |