SBOS671D September   2018  – December 2022 OPA2828 , OPA828

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Phase-Reversal Protection
      2. 7.3.2  Electrical Overstress
      3. 7.3.3  MUX Friendly Inputs
      4. 7.3.4  Overload Power Limiter
      5. 7.3.5  Noise Performance
        1. 7.3.5.1 Low Noise
      6. 7.3.6  Capacitive Load and Stability
      7. 7.3.7  Settling Time
      8. 7.3.8  Slew Rate
      9. 7.3.9  Full-Power Bandwidth
      10. 7.3.10 Small-Signal Response
      11. 7.3.11 Thermal Shutdown
      12. 7.3.12 Low Offset Voltage Drift
      13. 7.3.13 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 SAR ADC Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Low-Pass Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
        2. 8.4.1.2 PowerPAD™ Design Considerations (DGN package only)
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (December 2018) to Revision D (December 2022)

  • Changed OPA828 and OPA2828 in DGN package from preview to production data and added associated contentGo

Changes from Revision B (December 2018) to Revision C (October 2022)

  • Added OPA828 and OPA2828 in DGN (HVSSOP, 8) preview package and associated content to data sheetGo
  • Added TA symbol to Ambient Temperature row in Recommended Operating Conditions Go
  • Added table note to Recommended Operating Conditions Go
  • Deleted VS from Electrical Characteristics, same data listed under Recommended Operating Conditions Go
  • Deleted TA from Electrical Characteristics, same data listed under Recommended Operating Conditions Go
  • Changed section title from Capacitive Load and Stability to Noise Performance Go
  • Added missing Equation 2Go
  • Added PowerPAD Design Considerations (DGN Package Only) sectionGo

Changes from Revision A (November 2018) to Revision B (December 2018)

  • First release of production-data data sheetGo