SBOS671D September   2018  – December 2022 OPA2828 , OPA828

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Phase-Reversal Protection
      2. 7.3.2  Electrical Overstress
      3. 7.3.3  MUX Friendly Inputs
      4. 7.3.4  Overload Power Limiter
      5. 7.3.5  Noise Performance
        1. 7.3.5.1 Low Noise
      6. 7.3.6  Capacitive Load and Stability
      7. 7.3.7  Settling Time
      8. 7.3.8  Slew Rate
      9. 7.3.9  Full-Power Bandwidth
      10. 7.3.10 Small-Signal Response
      11. 7.3.11 Thermal Shutdown
      12. 7.3.12 Low Offset Voltage Drift
      13. 7.3.13 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 SAR ADC Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Low-Pass Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
        2. 8.4.1.2 PowerPAD™ Design Considerations (DGN package only)
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1.1 Thermal Considerations

Through normal operation, the OPAx828 self-heat. Self-heating is a natural increase in the die junction temperature that occurs in every amplifier. This self-heating is a result of several factors, including quiescent power consumption, package thermal resistance, PCB layout, and device operating conditions.

To make sure that the amplifier operates without entering thermal shutdown, use Equation 7 to calculate the approximate junction (die) temperature:

Equation 7. GUID-BBE9065C-5E8A-46F1-A8B2-D24299C7E465-low.gif

As an example, Equation 8 calculates the approximate junction temperature for the OPA828 (D package) while unloaded with an ambient temperature of 25°C.

Equation 8. GUID-2C882F2F-8254-4EB0-985E-BAC5ACE6E219-low.gif

For high-voltage, high-precision amplifiers, such as the OPAx828, the junction temperature can easily be tens of degrees higher than the ambient temperature in a quiescent (unloaded) condition. As shown by Equation 7 and Equation 8, the junction temperature depends on the thermal properties of the package, as expressed by the junction-to-ambient thermal resistance (RϴJA). If the device then begins to drive a heavy load, the junction temperature can rise and trip the thermal-shutdown circuit. For such loading cases, the DGN package includes a thermal pad that significantly reduces RϴJA. Proper PCB layout is essential to realize this improved thermal behavior. Figure 8-7 and Figure 8-8 show the maximum output voltage of the OPAx828 without entering thermal shutdown versus ambient temperature in both a loaded and unloaded condition for the different package versions.

Figure 8-7 OPAx828 Thermal Safe Operating Area Unloaded
Figure 8-8 OPAx828 Thermal Safe Operating Area for 600-Ω Load