SBOS263H October   2002  – December 2024 OPA830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for D Package VS = ±5V
    6. 6.6  Electrical Characteristics for D Package VS = 5V
    7. 6.7  Electrical Characteristics for D Package VS = 3V
    8. 6.8  Electrical Characteristics for DBV Package VS = ±5V
    9. 6.9  Electrical Characteristics for DBV Package VS = 5V
    10. 6.10 Electrical Characteristics for DBV Package VS = 3V
    11. 6.11 Typical Characteristics: VS = ±5V
    12. 6.12 Typical Characteristics: VS = ±5V, Differential Configuration
    13. 6.13 Typical Characteristics: VS = 5V
    14. 6.14 Typical Characteristics: VS = 5V, Differential Configuration
    15. 6.15 Typical Characteristics: VS = 3V
    16. 6.16 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  DC Level-Shifting
      3. 8.1.3  Optimizing Resistor Values
      4. 8.1.4  Bandwidth Versus Gain: Noninverting Operation
      5. 8.1.5  Inverting Amplifier Operation
      6. 8.1.6  Output Current and Voltages
      7. 8.1.7  Driving Capacitive Loads
      8. 8.1.8  Distortion Performance
      9. 8.1.9  Noise Performance
      10. 8.1.10 DC Accuracy and Offset Control
      11. 8.1.11 Thermal Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Supply ADC Interface
      2. 8.2.2 AC-Coupled Output Video Line Driver
      3. 8.2.3 Noninverting Amplifier With Reduced Peaking
      4. 8.2.4 Single-Supply Active Filter
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Demonstration Boards
        2. 9.1.1.2 Macromodel and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1.1 Input and ESD Protection

The OPA830 is built using a very high-speed complementary bipolar process. The internal junction breakdown voltages are relatively low for these very small geometry devices. These breakdowns are reflected in the Absolute Maximum Ratings. All device pins are protected with internal ESD protection diodes to the power supplies, as in Figure 8-11.

OPA830 Internal ESD Protection Figure 8-11 Internal ESD Protection

These diodes provide moderate protection to input overdrive voltages greater than the supplies as well. The protection diodes can typically support 30mA continuous current. Where higher currents are possible (that is, in systems with ±15V supply parts driving into the OPA830), add current-limiting series resistors into the two inputs. Keep these resistor values as low as possible because high values degrade both noise performance and frequency response.