SBOS263H October   2002  – December 2024 OPA830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for D Package VS = ±5V
    6. 6.6  Electrical Characteristics for D Package VS = 5V
    7. 6.7  Electrical Characteristics for D Package VS = 3V
    8. 6.8  Electrical Characteristics for DBV Package VS = ±5V
    9. 6.9  Electrical Characteristics for DBV Package VS = 5V
    10. 6.10 Electrical Characteristics for DBV Package VS = 3V
    11. 6.11 Typical Characteristics: VS = ±5V
    12. 6.12 Typical Characteristics: VS = ±5V, Differential Configuration
    13. 6.13 Typical Characteristics: VS = 5V
    14. 6.14 Typical Characteristics: VS = 5V, Differential Configuration
    15. 6.15 Typical Characteristics: VS = 3V
    16. 6.16 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  DC Level-Shifting
      3. 8.1.3  Optimizing Resistor Values
      4. 8.1.4  Bandwidth Versus Gain: Noninverting Operation
      5. 8.1.5  Inverting Amplifier Operation
      6. 8.1.6  Output Current and Voltages
      7. 8.1.7  Driving Capacitive Loads
      8. 8.1.8  Distortion Performance
      9. 8.1.9  Noise Performance
      10. 8.1.10 DC Accuracy and Offset Control
      11. 8.1.11 Thermal Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Supply ADC Interface
      2. 8.2.2 AC-Coupled Output Video Line Driver
      3. 8.2.3 Noninverting Amplifier With Reduced Peaking
      4. 8.2.4 Single-Supply Active Filter
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Demonstration Boards
        2. 9.1.1.2 Macromodel and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision G (November 2024) to Revision H (December 2024)

  • Updated power supply for DBV package in Absolute Maximum Ratings Go
  • Added D package electrical characteristics back into Specifications Go
  • Moved electrical characteristics for DBV and D packages into separate tablesGo

Changes from Revision F (August 2008) to Revision G (November 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Table of Contents, Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Parameter Measurement Information, Application and Implementation, Typical Applications, Layout, Layout Guidelines, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added the Package Information table in Description Go
  • Updated electrical characteristics to match device performanceGo
  • Updated plots in Typical Characteristics Go
  • Updated θJA in Thermal Analysis Go

Changes from Revision E (August 2007) to Revision F (August 2008)

  • Changed Storage temperature minimum value from −40°C to −65°C in Absolute Maximum Ratings Go

Changes from Revision D (March 2006) to Revision E (August 2007)

  • Changed 550V/ns to 550V/μs in Features Go