SBOS263H October   2002  – December 2024 OPA830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for D Package VS = ±5V
    6. 6.6  Electrical Characteristics for D Package VS = 5V
    7. 6.7  Electrical Characteristics for D Package VS = 3V
    8. 6.8  Electrical Characteristics for DBV Package VS = ±5V
    9. 6.9  Electrical Characteristics for DBV Package VS = 5V
    10. 6.10 Electrical Characteristics for DBV Package VS = 3V
    11. 6.11 Typical Characteristics: VS = ±5V
    12. 6.12 Typical Characteristics: VS = ±5V, Differential Configuration
    13. 6.13 Typical Characteristics: VS = 5V
    14. 6.14 Typical Characteristics: VS = 5V, Differential Configuration
    15. 6.15 Typical Characteristics: VS = 3V
    16. 6.16 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  DC Level-Shifting
      3. 8.1.3  Optimizing Resistor Values
      4. 8.1.4  Bandwidth Versus Gain: Noninverting Operation
      5. 8.1.5  Inverting Amplifier Operation
      6. 8.1.6  Output Current and Voltages
      7. 8.1.7  Driving Capacitive Loads
      8. 8.1.8  Distortion Performance
      9. 8.1.9  Noise Performance
      10. 8.1.10 DC Accuracy and Offset Control
      11. 8.1.11 Thermal Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Supply ADC Interface
      2. 8.2.2 AC-Coupled Output Video Line Driver
      3. 8.2.3 Noninverting Amplifier With Reduced Peaking
      4. 8.2.4 Single-Supply Active Filter
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Demonstration Boards
        2. 9.1.1.2 Macromodel and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.