SLOS224J July   1999  – February 2024 THS4031 , THS4032

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: THS4031
    5. 5.5  Thermal Information: THS4032
    6. 5.6  Electrical Characteristics: THS4031, RL = 150 Ω
    7. 5.7  Electrical Characteristics: THS4031, RL = 1 kΩ
    8. 5.8  Electrical Characteristics: THS4032, RL = 150 Ω
    9. 5.9  Electrical Characteristics: THS4032, RL = 1 kΩ
    10. 5.10 Typical Characteristics: THS4031
    11. 5.11 Typical Characteristics: THS4032
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 Low-pass Filter Configurations
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selection of Multiplexer
        2. 7.2.2.2 Signal Source
        3. 7.2.2.3 Driving Amplifier
        4. 7.2.2.4 Driving Amplifier Bandwidth Restriction
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 General PowerPAD™ Design Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.1 Driving a Capacitive Load

The THS403x devices are internally compensated to maximize bandwidth and slew-rate performance. Take additional precautions when driving capacitive loads with a high-performance amplifier to maintain stability. As a result of the internal compensation, significant capacitive loading directly on the output node decreases the device phase margin, and potentially leads to high-frequency ringing or oscillations. Therefore, for capacitive loads greater than 10 pF, place an isolation resistor in series with the output of the amplifier. Figure 7-1 shows this configuration. For most applications, a minimum resistance of 20 Ω is recommended. In 75‑Ω transmission systems, setting the series resistor value to 75 Ω is a beneficial choice because this value isolates any capacitance loading and provides source impedance matching.

GUID-D7BA7947-179A-42A3-A1E4-28CB37F15216-low.gifFigure 7-1 Driving a Capacitive Load