SBOS891C October   2018  – September 2023 TMP144

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 UART Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Digital Temperature Output
      3. 7.3.3 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
      4. 7.4.4 Extended Temperature Mode
      5. 7.4.5 Temperature Alert Function
      6. 7.4.6 Interrupt Functionality
    5. 7.5 SMAART Wire / UART Interface
      1. 7.5.1 Communication Protocol
      2. 7.5.2 Global Software Reset
      3. 7.5.3 Global Initialization and Address Assignment Sequence
      4. 7.5.4 Global Clear Interrupt
      5. 7.5.5 Global Read and Write
      6. 7.5.6 Individual Read and Write
    6. 7.6 Register Maps
      1. 7.6.1 Temperature Result Register (P[1:0] = 00) [reset = 0000h]
      2. 7.6.2 Configuration Register (P[1:0] = 01) [reset = 0200h]
      3. 7.6.3 Temperature Low Limit Register (P[1:0] = 10) [reset = F600h]
      4. 7.6.4 Temperature High Limit Register (P[1:0] = 11) [reset = 3C00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Trace Length
        2. 8.2.2.2 Voltage Drop Effect
        3. 8.2.2.3 Power Supply Noise Filtering
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBK|4
  • YFF|4
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.2 Voltage Drop Effect

Take into account the voltage drop that occurs along the supply and ground lines as a result of the currents of all the devices on the line. This voltage drop occurs as a result of multiple devices simultaneously consuming current through the combined resistance of the common wire, connectors, and solder contacts. Make sure that the supply on the last device does not fall below the minimum operating supply of 1.4 V.