SBOS891C October   2018  – September 2023 TMP144

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 UART Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Digital Temperature Output
      3. 7.3.3 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
      4. 7.4.4 Extended Temperature Mode
      5. 7.4.5 Temperature Alert Function
      6. 7.4.6 Interrupt Functionality
    5. 7.5 SMAART Wire / UART Interface
      1. 7.5.1 Communication Protocol
      2. 7.5.2 Global Software Reset
      3. 7.5.3 Global Initialization and Address Assignment Sequence
      4. 7.5.4 Global Clear Interrupt
      5. 7.5.5 Global Read and Write
      6. 7.5.6 Individual Read and Write
    6. 7.6 Register Maps
      1. 7.6.1 Temperature Result Register (P[1:0] = 00) [reset = 0000h]
      2. 7.6.2 Configuration Register (P[1:0] = 01) [reset = 0200h]
      3. 7.6.3 Temperature Low Limit Register (P[1:0] = 10) [reset = F600h]
      4. 7.6.4 Temperature High Limit Register (P[1:0] = 11) [reset = 3C00h]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Trace Length
        2. 8.2.2.2 Voltage Drop Effect
        3. 8.2.2.3 Power Supply Noise Filtering
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBK|4
  • YFF|4
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Individual Read and Write

The host can initiate an individual read and write command to a particular TMP144 device in the daisy-chain by sending the read/write command. The read/write command consists of these parameters:

  • C[7] = 0 (Individual device access)
  • C[6:3] = the device ID (ID[3:0])
  • C[2:1] = the data register pointer (P[1:0]); see Table 7-3
  • C[0] = indicates read/write control

As shown in Figure 7-14, an individual device write command is indicated by C[0] = 0. The host must transfer at least one more byte of data for the register indicated by bits C[2:1]. The TMP144 in the daisy-chain that corresponds to the device ID noted by bits C[6:3] then updates the appropriate register.

GUID-20200826-CA0I-D3VG-NRS3-BHWMRBRNNMCX-low.gifFigure 7-14 Individual Write Command Flow.

As shown in Figure 7-15, an individual device read command is indicated by C[0] = 1. As shown in Figure 7-16, the TMP144 in the daisy-chain that corresponds to the device ID pointed by bits C[6:3] then breaks the bus, transmits the data from the register pointed by bits C[2:1], and reconnects the bus.

GUID-20200826-CA0I-84JW-4VQT-N75B5WFHL2D1-low.gif Figure 7-15 Individual Read Command Flow.
GUID-27E10A14-587F-434A-A718-B056C3DF3F0A-low.gifFigure 7-16 TMP144 Daisy-Chain: Bus Status During Individual Read Operation of Second Device