SBOS891C October   2018  – September 2023 TMP144

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 UART Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Digital Temperature Output
      3. 7.3.3 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
      4. 7.4.4 Extended Temperature Mode
      5. 7.4.5 Temperature Alert Function
      6. 7.4.6 Interrupt Functionality
    5. 7.5 SMAART Wire / UART Interface
      1. 7.5.1 Communication Protocol
      2. 7.5.2 Global Software Reset
      3. 7.5.3 Global Initialization and Address Assignment Sequence
      4. 7.5.4 Global Clear Interrupt
      5. 7.5.5 Global Read and Write
      6. 7.5.6 Individual Read and Write
    6. 7.6 Register Maps
      1. 7.6.1 Temperature Result Register (P[1:0] = 00) [reset = 0000h]
      2. 7.6.2 Configuration Register (P[1:0] = 01) [reset = 0200h]
      3. 7.6.3 Temperature Low Limit Register (P[1:0] = 10) [reset = F600h]
      4. 7.6.4 Temperature High Limit Register (P[1:0] = 11) [reset = 3C00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Trace Length
        2. 8.2.2.2 Voltage Drop Effect
        3. 8.2.2.3 Power Supply Noise Filtering
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBK|4
  • YFF|4
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (April 2021) to Revision C (September 2023)

  • Added YBK package optionGo

Changes from Revision A (February 2021) to Revision B (April 2021)

  • Removed Advanced Information note from YMT packageGo
  • Updated thermal information for YMT packageGo
  • Added typical value for pin capacitanceGo
  • Added active conversion current consumption limit valuesGo
  • Added Figure 6-5 to the Typical Characteristics sectionGo

Changes from Revision * (October 2018) to Revision A (February 2021)

  • Changed data sheet status from Production Data to Production MixedGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Advanced Information YMT packageGo
  • Updated absolute max supply voltage from 3.6V to 4.0VGo
  • Updated TX pin absolute max from (V+) + 0.3 V to (V+) + 0.3 and ≤ 4 VGo
  • Added digital temperature output section for result readout with different ETM mode settingGo
  • Updated the communication protocol descriptionGo
  • Added command byte value tableGo
  • Added command flow for global software resetGo
  • Added command flow for global initialization and address assignmentGo
  • Added command flow for global clear interruptGo
  • Added command flow for global read and writeGo
  • Added command flow for individual read and writeGo
  • Updated Register Map as per new formatGo
  • Updated temperature result register as a 16-bit value to map to the communication protocolGo
  • Updated configuration register as a 16-bit value to map to the communication protocolGo
  • Updated temperature low limit register as a 16-bit value to map to the communication protocolGo
  • Updated temperature high limit register as a 16-bit value to map to the communication protocolGo